Abstract: A reticle box characterized by a generally rectangular base member having a base portion and four contiguous wall portions, a generally rectangular cover member which can be engaged with the base member to fully enclose a reticle, and a closing mechanism which causes resilient stand-offs attached to the base member and the cover member to firmly grip the reticle within the box. Mating peripheral seals are provided around portions of the base member and the cover member to prevent the influx of contaminants. The cover member is of unitary design with an integral frame portion, central cover portion, and hinge. The reticle box is preferably made from a non-static plastic material.

Abstract: A method (and semiconductor devices and wafers producers therefrom) is provided which method comprises providing a semiconductor wafer which comprises at least two physically interconnected semiconductor devices including at least one scribe lane formed at a peripheral edge between the semiconductor devices; covering at least a portion of the scribe lane with a continuous metal film, forming metal limiting means in the metal film of predetermined configuration and spacing so that no space between the metal limiting means exceeds 10 microns in any direction; and thereafter scribing the semiconductor wafer to produce a device containing bent metal portions within the range of 0 to 10 microns.

Abstract: A method and semiconductor devices and wafers produced therefrom are provided which comprise at least one scribe lane formed in at least a peripheral edge, a metal film covering at least a portion of said scribe lane and having metal limiting means so preselectively spaced and configured that scribing the wafer in any direction along said portion of the scribe lane containing metal limiting means will result in a bent metal portion within the range of about 0 to 10 microns.