Patents by Inventor Edward Rhem

Edward Rhem has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND ASSEMBLED BOARDS MADE USING THE SAME
    Publication number: 20240341040
    Abstract: Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.
    Type: Application
    Filed: June 17, 2024
    Publication date: October 10, 2024
    Inventors: Subramanian Vasudevan, Edward Rhem, Philip Conde, Wallace Ables, Edwin C. Tinsley
  • Printed circuit board assembly process using multiple solders and assembled boards made using the same
    Patent number: 12035483
    Abstract: Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: July 9, 2024
    Assignee: Dell Products L.P.
    Inventors: Subramanian Vasudevan, Edward Rhem, Philip Conde, Wallace Ables, Edwin C. Tinsley
  • Printed Circuit Board Assembly Process Using Multiple Solders And Assembled Boards Made Using The Same
    Publication number: 20210315107
    Abstract: Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.
    Type: Application
    Filed: April 3, 2020
    Publication date: October 7, 2021
    Inventors: Subramanian Vasudevan, Edward Rhem, Philip Conde, Wallace Ables, Edwin C. Tinsley