Abstract: The present invention describes electroformed thin-wall nickel core drills that are impregnated with diamond abrasives. The thin-wall core drills are formed with a plurality of raised portions and an equal plurality of recessed portions, with each raised portion alternating with a recessed portion, the raised and recessed portions are substantially parallel and are connected by transition portions. In another embodiment, some of the transition regions are formed with intermediate steps or partially raised and recessed portions. These intermediate steps or partially raised or recessed portions allow more uniform distribution of matrix material across a kerf width D1 as the core drill is spun, thereby, giving the cut edge a substantially square profile.

Abstract: A method for fabrication of a semiconductor device on a substrate, the semiconductor having a wafer. The method includes the steps:(a) applying a seed layer of a thermally conductive metal to the wafer;(b) electroplating a relatively thick layer of the conductive metal on the seed layer, and(c) removing the substrate. A corresponding semiconductor device is also disclosed.

Abstract: The present invention describes electroformed thin-wall nickel cutting saws or blades that are impregnated with diamond abrasives. The thin-wall saws are formed with a plurality of raised portions and an equal plurality of recessed portions, with each raised portion alternating with a recessed portion, the raised and recessed portions are substantially parallel and are connected by transition portions. In another embodiment, some of the transition regions are formed with intermediate steps or partially raised and recessed portions. These intermediate steps or partially recessed and raised portions allow more uniform distribution of matrix material across a kerf width D1 as the cutting saw is spun, thereby, giving the cut edge a substantially square profile.

Abstract: The present invention describes electroformed thin-wall nickel core drills that are impregnated with diamond abrasives. The thin-wall core drills are formed with a plurality of raised portions and an equal plurality of recessed portions, with each raised portion alternating with a recessed portion, the raised and recessed portions are substantially parallel and are connected by transition portions. In another embodiment, some of the transition regions are formed with intermediate steps or partially raised and recessed portions. These intermediate steps or partially raised or recessed portions allow more uniform distribution of matrix material across a kerf width D1 as the core drill is spun, thereby, giving the cut edge a substantially square profile.

Abstract: The present invention describes electroformed thin-wall nickel cutting saws or blades that are impregnated with diamond abrasives. The thin-wall saws are formed with a plurality of raised portions and an equal plurality of recessed portions, with each raised portion alternating with a recessed portion, the raised and recessed portions are substantially parallel and are connected by transition portions. In another embodiment, some of the transition regions are formed with intermediate steps or partially raised and recessed portions. These intermediate steps or partially recessed and raised portions allow more uniform distribution of matrix material across a kerf width D1 as the cutting saw is spun, thereby, giving the cut edge a substantially square profile.

Abstract: A method for fabrication of a light emitting device on a substrate, the light emitting device having a wafer with multiple epitaxial layers and an ohmic contact layer on the epitaxial layers remote from the substrate. The method includes the steps: (a) applying to the ohmic contact layer a seed layer of a thermally conductive metal; (b) electroplating a relatively thick layer of the conductive metal on the seed layer; and (c) removing the substrate. A corresponding light emitting device is also disclosed. The light emitting device is a GaN light emitting diode or laser diode.

Abstract: A method for fabrication of a semiconductor device on a substrate, the semiconductor having a wafer. The method includes the steps:(a) applying a seed layer of a thermally conductive metal to the wafer; (b) electroplating a relatively thick layer of the conductive metal on the seed layer, and(c) removing the substrate. A corresponding semiconductor device is also disclosed.

Abstract: A thin wall saw blade for cutting hard materials both clean and fast without clogging comprises a corrugated shaped electro-deposited matrix metal that encapsulate large diamonds so that the large diamonds have points or protrusions extending outward from the thin walls of the corrugated saw blade. The thin wall saw blade further includes small diamonds encapsulated inside the matrix metal. The density of the large and small diamonds by volume exceeds fifty percent so that the blade cuts fast and clean without clogging and is particularly well suited for singulating multi-layered substrates that include plastic and/or metal layers in or on the substrate.