Patents by Inventor Edward Skorupski

Edward Skorupski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nickel coated copper as electrodes for embedded passive devices
    Patent number: 6610417
    Abstract: The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: August 26, 2003
    Assignee: Oak-Mitsui, Inc.
    Inventors: John A. Andresakis, Edward Skorupski, Wendy Herrick, Michael D. Woodry
  • Nickel coated copper as electrodes for embedded passive devices
    Publication number: 20030068517
    Abstract: The invention relates to the manufacture of metal foil electrodes useful in the manufacture of printed circuit boards having passive circuit components such as capacitors, resistors or inductors configured in a planar orientation. A copper foil is coated on each opposite side with a thin layer of nickel, which increases the range of functionality of the foil.
    Type: Application
    Filed: October 4, 2001
    Publication date: April 10, 2003
    Inventors: John A. Andresakis, Edward Skorupski, Wendy Herrick, Michael D. Woodry