Patents by Inventor Edward Stark
Edward Stark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11972994Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.Type: GrantFiled: April 12, 2023Date of Patent: April 30, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Sreenivasan Kalyani Koduri, Leslie Edward Stark, Steven Alfred Kummerl, Wai Lee
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Patent number: 11894339Abstract: A method of manufacturing a sensor device includes obtaining a semiconductor die structure comprising a transmitter and a receiver. Then, a first sacrificial stud is affixed to the transmitter and a second sacrificial stud is affixed to the receiver. The semiconductor die is affixed to a lead frame, and pads on the semiconductor die structure are wirebonded to the lead frame. The lead frame, the semiconductor die structure, and the wirebonds are encapsulated in a molding compound, while the tops of the first and second sacrificial studs are left exposed. The first and second sacrificial studs prevent the molding compound from encapsulating the transmitter and the receiver, and are removed to expose the transmitter in a first cavity and the receiver in a second cavity. In some examples, the semiconductor die structure includes a first semiconductor die comprising the transmitter and a second semiconductor die comprising the receiver.Type: GrantFiled: December 14, 2020Date of Patent: February 6, 2024Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Sreenivasan Kalyani Koduri, Leslie Edward Stark
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Publication number: 20240038609Abstract: In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.Type: ApplicationFiled: October 10, 2023Publication date: February 1, 2024Inventors: Sreenivasan Kalyani KODURI, Leslie Edward STARK
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Patent number: 11784103Abstract: In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.Type: GrantFiled: December 9, 2020Date of Patent: October 10, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Sreenivasan Kalyani Koduri, Leslie Edward Stark
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Publication number: 20230253277Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.Type: ApplicationFiled: April 12, 2023Publication date: August 10, 2023Inventors: Sreenivasan Kalyani KODURI, Leslie Edward STARK, Steven Alfred KUMMERL, Wai LEE
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Patent number: 11658083Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.Type: GrantFiled: December 9, 2020Date of Patent: May 23, 2023Assignee: Texas Instruments IncorporatedInventors: Sreenivasan Kalyani Koduri, Leslie Edward Stark, Steven Alfred Kummerl, Wai Lee
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Publication number: 20230030266Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.Type: ApplicationFiled: September 30, 2022Publication date: February 2, 2023Inventors: Sreenivasan Kalyani KODURI, Leslie Edward STARK
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Patent number: 11476175Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.Type: GrantFiled: December 17, 2020Date of Patent: October 18, 2022Assignee: Texas Instruments IncorporatedInventors: Sreenivasan Kalyani Koduri, Leslie Edward Stark
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Patent number: 11384216Abstract: A process for forming voided latex particles is improved by combining swelling and polymerization of an outer shell into a single step. The process includes contacting multi-stage emulsion polymer particles comprising a core, at least one intermediate shell, with a swelling agent, and polymerizing an outer shell after said contacting with swelling agent wherein the core and the at least one intermediate shell are contacted with swelling agent in the presence of less than 0.5% monomer based on the weight of the multi-stage emulsion polymer particles, and substantially all of the swelling occurs during polymerization of the outer shell.Type: GrantFiled: June 10, 2019Date of Patent: July 12, 2022Assignee: Arkema Inc.Inventors: Lily Liu, Wayne Devonport, Daniel Edward Stark, Sr., Matthew F. Boudreaux
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Publication number: 20220199479Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.Type: ApplicationFiled: December 17, 2020Publication date: June 23, 2022Inventors: Sreenivasan Kalyani KODURI, Leslie Edward STARK
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Publication number: 20220189912Abstract: A method of manufacturing a sensor device includes obtaining a semiconductor die structure comprising a transmitter and a receiver. Then, a first sacrificial stud is affixed to the transmitter and a second sacrificial stud is affixed to the receiver. The semiconductor die is affixed to a lead frame, and pads on the semiconductor die structure are wirebonded to the lead frame. The lead frame, the semiconductor die structure, and the wirebonds are encapsulated in a molding compound, while the tops of the first and second sacrificial studs are left exposed. The first and second sacrificial studs prevent the molding compound from encapsulating the transmitter and the receiver, and are removed to expose the transmitter in a first cavity and the receiver in a second cavity. In some examples, the semiconductor die structure includes a first semiconductor die comprising the transmitter and a second semiconductor die comprising the receiver.Type: ApplicationFiled: December 14, 2020Publication date: June 16, 2022Inventors: Sreenivasan Kalyani KODURI, Leslie Edward STARK
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Publication number: 20220181223Abstract: In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.Type: ApplicationFiled: December 9, 2020Publication date: June 9, 2022Inventors: Sreenivasan Kalyani KODURI, Leslie Edward STARK
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Publication number: 20220181224Abstract: In some examples, a sensor package includes a semiconductor die having a sensor; a mold compound covering a portion of the semiconductor die; and a cavity formed in a top surface of the mold compound, the sensor being in the cavity. The sensor package includes an adhesive abutting the top surface of the mold compound, and a semi-permeable film abutting the adhesive and covering the cavity. The semi-permeable film is approximately flush with at least four edges of the top surface of the mold compound.Type: ApplicationFiled: December 9, 2020Publication date: June 9, 2022Inventors: Sreenivasan Kalyani KODURI, Leslie Edward STARK, Steven Alfred KUMMERL, Wai LEE
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Publication number: 20220173256Abstract: In some examples, an optical sensor package comprises a semiconductor die; an opaque mold compound covering the semiconductor die and having a cavity; and an optical sensor on the semiconductor die and exposed to the cavity. The optical sensor package includes a glass member inside the cavity. The glass member abuts the sensor and a wall of the cavity. The glass member is exposed to an exterior environment of the optical sensor package. The glass member has a thickness approximately equivalent to a depth of the cavity.Type: ApplicationFiled: December 2, 2020Publication date: June 2, 2022Inventors: Sreenivasan Kalyani KODURI, Leslie Edward STARK
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Publication number: 20220155109Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a ring encircling the sensor. The sensor and an inner surface of the ring are exposed to an exterior environment of the sensor package. The sensor package includes a mold compound covering the semiconductor die and abutting an outer surface of the ring.Type: ApplicationFiled: November 18, 2020Publication date: May 19, 2022Inventors: Sreenivasan Kalyani KODURI, Christopher Daniel MANACK, Leslie Edward STARK
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Patent number: 10442882Abstract: A process for forming voided latex particles is improved by combining swelling and polymerization of an outer shell into a single step. The process includes contacting multi-stage emulsion polymer particles comprising a core, at least one intermediate shell, with a swelling agent, and polymerizing an outer shell after said contacting with swelling agent wherein the core and the at least one intermediate shell are contacted with swelling agent in the presence of less than 0.5% monomer based on the weight of the multi-stage emulsion polymer particles, and substantially all of the swelling occurs during polymerization of the outer shell.Type: GrantFiled: August 7, 2015Date of Patent: October 15, 2019Assignee: Arkema Inc.Inventors: Lily Liu, Wayne Devonport, Daniel Edward Stark, Matthew F. Boudreaux
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Publication number: 20190292346Abstract: A process for forming voided latex particles is improved by combining swelling and polymerization of an outer shell into a single step. The process includes contacting multi-stage emulsion polymer particles comprising a core, at least one intermediate shell, with a swelling agent, and polymerizing an outer shell after said contacting with swelling agent wherein the core and the at least one intermediate shell are contacted with swelling agent in the presence of less than 0.5% monomer based on the weight of the multi-stage emulsion polymer particles, and substantially all of the swelling occurs during polymerization of the outer shell.Type: ApplicationFiled: June 10, 2019Publication date: September 26, 2019Inventors: Lily Liu, Wayne Devonport, Daniel Edward Stark, SR., Matthew F. Boudreaux
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Patent number: 10351689Abstract: A process for forming voided latex particles is improved by combining swelling and polymerization of an outer shell into a single step. The process includes contacting multi-stage emulsion polymer particles comprising a core, at least one intermediate shell, with a swelling agent, and polymerizing an outer shell after said contacting with swelling agent wherein the core and the at least one intermediate shell are contacted with swelling agent in the presence of less than 0.5% monomer based on the weight of the multi-stage emulsion polymer particles, and substantially all of the swelling occurs during polymerization of the outer shell.Type: GrantFiled: August 7, 2015Date of Patent: July 16, 2019Assignee: Arkema Inc.Inventors: Lily Liu, Wayne Devonport, Daniel Edward Stark, Matthew F. Boudreaux
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Publication number: 20180308069Abstract: A method and system of a vehicle service. Such a method and system are related to computer-assisted software for summoning servicing of a vehicle. With the software, a customer and mechanics may communicate each other to offer and accept proper vehicle services.Type: ApplicationFiled: April 18, 2018Publication date: October 25, 2018Inventor: Garrick Edward STARKS
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Patent number: 9899339Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.Type: GrantFiled: November 5, 2012Date of Patent: February 20, 2018Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Matthew David Romig, Lance Cole Wright, Leslie Edward Stark, Frank Stepniak, Sreenivasan K. Koduri