Abstract: A light projector assembly for irradiating the interior of a bin when the bin is in a predetermined position, the bin having walls and a ceiling. A bin interior may include a plant-growing zone proximate a bottom of the bin. The walls may include one or more light-transmissive windows above the plant-growing zone. The light projector assembly may comprise a light projector and a support structure. A light projector may be supported outside of the bin position and proximate to and spaced from one of the one or more windows when the bin assembly is in the predetermined position. The light projector may be configured to project light upwardly through the one window and toward the ceiling. A support structure may support the light projector. The support structure may be spaced from a vertical extension of the predetermined position, unobstructive of vertical access to the bin.

Abstract: A light projector assembly for irradiating the interior of a bin when the bin is in a predetermined position, the bin having walls and a ceiling. A bin interior may include a plant-growing zone proximate a bottom of the bin. The walls may include one or more light-transmissive windows above the plant-growing zone. The light projector assembly may comprise a light projector and a support structure. A light projector may be supported outside of the bin position and proximate to and spaced from one of the one or more windows when the bin assembly is in the predetermined position. The light projector may be configured to project light upwardly through the one window and toward the ceiling. A support structure may support the light projector. The support structure may be spaced from a vertical extension of the predetermined position, unobstructive of vertical access to the bin.

Abstract: An electromagnetic shield assembly mounted on a substrate. The electromagnetic shield assembly may have an interior surface spaced from the substrate and may bound a hollow chamber over a circuit assembly. The hollow chamber may be filled with a fluid, such as a gas or a liquid. The electromagnetic shield assembly may also have an edge extending along the substrate around the circuit assembly and may include an electromagnetic shield and a conductive assembly. The electromagnetic shield may substantially enclose the hollow chamber bounded by the electromagnetic shield assembly. The conductive assembly may extend along and may be electrically isolated from the electromagnetic shield. The conductive assembly may be conductively coupled to the circuit assembly.

Abstract: A coupler may include four ports, and first and second sets of conductive strips. Each set of conductive strips may include a plurality of interconnected conductive strips connected between two ports. Each conductive strip of the first set may be electromagnetically coupled to a conductive strip of the second set. Conductive tabs capacitively coupled directly or indirectly to the ground conductor may extend from conductive strips of the first and second sets. An interconnection may be positioned between adjacent tabs, the interconnection connecting conductive strips of one of the sets of conductive strips. The adjacent tabs may be spaced different distances from the interconnection.

Abstract: A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the trench, and optionally, may divide the trench into sections. A conductive adhesive layer may be applied to the substrate face and, if included, the bridge. One or more circuit chips may be mounted on the adhesive layer, with at least one edge of one circuit chip adjacent to the trench. Alternatively or additionally, an adhesive layer may be applied to a base of a chip and then mounted to the substrate face, in like fashion. The trench may accommodate excess adhesive flowing out from under the one or more chips, while the bridge retains the adhesive across the width of the trench. If the adhesive is conductive, this provides continuity of the conductive layer on the face of the substrate across the trench.

Abstract: An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a length of the first dielectric layer. First and second conductive layers may be disposed on respective portions of the first and second surfaces. A first conductor, having an end, may be disposed on a surface of the first dielectric layer, including at least a first portion extending around at least a portion of the conductor end. The second conductive layer may line the channel extending around a portion of the conductor end. Some examples may include a stripline having a second conductor connected to the first conductor. Some examples may include a cover having a wall positioned on the first dielectric over the second conductor.

Abstract: A method and apparatus for coupling a conductor-based transmission line, such as a strip transmission line, to a waveguide. The transmission line may be separated from a corresponding conducting ground plane by a first dielectric substrate layer. The ground plane may be adhesively coupled to a portion of the waveguide, and may be offset from the interior of the waveguide, so that adhesive squeezed out between the ground plane and the waveguide may be at least partially shielded from the waveguide, and thus does not significantly perturb electromagnetic signals within the waveguide.

Abstract: An example of an electromagnetic (EM) shield assembly may include a top and sides, which together form a chamber configured to house a circuit assembly. The EM shield assembly may include a conductive shield layer and a dielectric layer. The top may include a conductive strip extending along the dielectric layer, while one or more sides may each include a via extending through the dielectric layer. A via may be adapted to provide a connection between a circuit conductor inside or outside the chamber with the conductive strip. In this manner the vias and the conductive strip are capable of forming a continuous circuit path within the EM shield assembly. Alternatively or additionally, some EM shield assemblies may include resistive material included on the interior surface.