Patents by Inventor Edward T. E. Hughes

Edward T. E. Hughes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices and a solder for use in such devices
    Patent number: 4504849
    Abstract: A semiconductor device, for example a power rectifier, formed in a semiconductor body has a contact area coated with a metal layer of, for example, gold. A metallic member is soldered to the layer with an alloy comprising at least 80% lead, the balance being indium and silver in a ratio of at least 4:1 and at most 10:1. One such solder which has good wetting characteristics for improved bond strength contains approximately 92% lead, 7% indium, and 1% silver.
    Type: Grant
    Filed: July 14, 1982
    Date of Patent: March 12, 1985
    Assignee: U.S. Philips Corporation
    Inventors: Neil A. Davies, Edward T. E. Hughes