Abstract: A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.

Abstract: A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.

Abstract: A wire feed system for a wire bonding machine is provided. The wire feed system includes (1) a wire supply, and (2) an air guide for receiving a length of wire from the wire supply. The air guide has an air inlet for receiving a pressurized fluid. The wire feed system is configured to apply a variable tension to the length of wire received by the air guide.

Abstract: A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.

Abstract: An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attaching the cantilever probe to a carrier structure by clamping the cantilever probe to the carrier structure, bonding the cantilever probe to the carrier structure via a post feature on the cantilever probe, or applying a material on the carrier structure and substantially around and in contact with the cantilever probe to affix the cantilever probe to the carrier structure. A probe tip can then be formed on the cantilever probe while the cantilever probe is attached or affixed to the carrier structure. The cantilever probe can then be removed and bonded to a probe substrate.

Abstract: A wire feed system for a wire bonding machine is provided. The wire feed system includes (1) a wire supply, and (2) an air guide for receiving a length of wire from the wire supply. The air guide has an air inlet for receiving a pressurized fluid. The wire feed system is configured to apply a variable tension to the length of wire received by the air guide.

Abstract: A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.

Abstract: A method and apparatus for repairing a probe on a probe card is provided. A plurality of beams is formed on a beam panel. The plurality of beams includes a replacement beam. After identifying a damaged beam on the probe card, the damaged beam is removed from the probe card. The beam panel is aligned with the probe card. After the beam panel is aligned, the aligned beam panel is temporarily affixed to the probe card. After the beam panel is temporarily affixed to the probe card, the replacement beam is affixed at a location previously occupied by the damaged beam. After the replacement beam is affixed at the location, the beam panel is removed from the probe card.

Abstract: A tool for attaching fine preformed probes to a substrate for use with a vacuum source is disclosed. The apparatus comprises a body portion; a tip portion disposed at one end of the body portion; a first orifice extending from a first end of the body portion to the working tip; and at least one second orifice extending from an outer portion of the working tip and communicating with the first orifice, wherein the vacuum source is coupled to the body portion so that a vacuum generated by the vacuum source is provided to the at least one second orifice.

Abstract: A die paste transfer system wherein a first layer of bonding paste is transfer to a surface of the die as the die moves through the paste station in a controlled manner. The control for the transport controls orientation which the die passes through the paste station and the orientation of the die at the bonding site. The height of the die is varied as it passes through a second layer of paste. The speed at which the die and the second layer of bonding paste move well to each other is also adjusted to produce the desired thickness of the first layer on the die. Shear is produced in the second layer to affect transfer of the bonding paste from the reservoir to the die. For larger dies, the die may enter and leave the paste more than once to produce individual plateaus spaced from the edge of the die.