Patents by Inventor Edward T. Pokriefka

Edward T. Pokriefka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible circuit board interconnect with strain relief
    Patent number: 5981870
    Abstract: A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: November 9, 1999
    Assignee: Chrysler Corporation
    Inventors: Tina Barcley, Robert A. Isola, Edward T. Pokriefka, Norman J. Roth, Vasil Germanski
  • Flexible circuit board interconnect with strain relief
    Patent number: 5924873
    Abstract: A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: July 20, 1999
    Assignee: Chrysler Corporation
    Inventors: Tina Barcley, Robert A. Isola, Edward T. Pokriefka, Norman J. Roth, Vasil Germanski
  • Flexible circuit board interconnect with strain relief
    Patent number: 5917149
    Abstract: A flexible circuit board interconnect is provided with flex strain relief capabilities. The flexible circuit board interconnect includes a polyamide or polyimide (both are nylons) substrate layer, a ground plane layer and a conductor strip layer. The ground plane layer is provided with scalloped edges along opposite sides thereof. The ground plane provides a shield for preventing radio frequency interference to and from the signals passed through the conductor strips. The ground plane layer and the conductor strips are covered at least partially by a pair of soldermask layers which are provided with scalloped edges. The scalloped edges on the soldermask layers and the ground plane prevent the generation of a crease or fold line on the surface of the flexible circuit board interconnect. Each of the conductor strips are provided with a pair of vias on opposite ends of thereof.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: June 29, 1999
    Assignee: DaimlerChrysler Corporation
    Inventors: Tina Barcley, Norman J. Roth, Vasil Germanski, Edward T. Pokriefka, Robert A. Isola