Abstract: The present invention is a compact, highly efficient method for convectively cooling substrates, where the substrates contain light emitting diodes (LEDs) or other highly dissipative electronic components. The methodology exhibits very low acoustic noise, extended operating life of moving parts and minimum susceptibility to dust. Also, the improved cooling methodology for high brightness light emitting diodes employs one or more high-density, high-surface-area, single or multiple-element metallic structures having superior heat-transfer properties in the presence of low-speed, minimally turbulent air flow, and enhanced electronic-power-management.

Abstract: In one general aspect, the invention features an illumination source that includes a power supply having alternating current input lines and positive and negative direct current output lines. A string of light emitting diodes is connected in series between the positive and negative direct current output lines in a forward-biased series. A direct current cooling fan has a first input line and a second input line operatively connected across at least one of the light emitting diodes and has a cooling air delivery direction positioned to cool a surface in thermal contact with a heat generating portion of at least one of the power supply and the string of light emitting diodes.

Abstract: A heat exchange system for an LED light fixture is provided. The heat exchange system includes an enclosure 4, a heat sink 9 positioned inside of and spaced apart from said enclosure 4, and a fan positioned inside of and spaced part from said enclosure 4. Heat is first transferred from LEDs 1 to heat sink 9. Heat is then transferred from heat sink 9 to the air within said enclosure 4 aided by fan 10. Heat is then transferred from the air inside of enclosure 4 to said enclosure 4 and then to outside ambient air. The enclosure 4 may be open (unsealed) or closed (sealed from a surrounding environment). The heat exchange system may be constructed from relatively simple and inexpensive components.

Abstract: In one general aspect, an illumination source is disclosed that comprises a housing, which can be made of a non-conducting material, and includes a cooling air intake port and a cooling air exhaust port. A circuit board is supported with respect to the housing and includes at least one insulating layer, and at least a first, electrically conductive layer on a first side of the insulating layer, with the first layer defining a plurality of pads and a plurality of traces interconnecting at least some of the pads. A socket is supported with respect to the housing and has a pair of connector surfaces for receiving power, and has an axis of insertion. A plurality of LED chips are each electrically connected to a plurality of the pads and each have an axis of illumination that is at least generally aligned with the axis of insertion.

Abstract: The present invention is a compact, highly efficient method for convectively cooling substrates, where the substrates contain light emitting diodes (LEDs) or other highly dissipative electronic components. The methodology exhibits very low acoustic noise, extended operating life of moving parts and minimum susceptibility to dust. Also, the improved cooling methodology for high brightness light emitting diodes employs one or more high-density, high-surface-area, single or multiple-element metallic structures having superior heat-transfer properties in the presence of low-speed, minimally turbulent air flow, and enhanced electronic-power-management.

Abstract: A surface mountable resistor chip assembly, containing an integral heat sink, convective cooling provision exhibits higher continuous-mode power ratings than prior art surface mount resistors having comparable printed circuit board footprints. The preferred embodiments are also configured so as to reduce transient thermal impedance in a manner to exhibit increased power rating under short duration overload conditions. The assembly includes a housing with passages, holes or slotted openings, for the chip assembly and for air flow therethrough, and electrically conductive paths to bring the chip electrical connections out to pads on the housing arranged to make electrical connections to a printed circuit board.

Abstract: An incandescent lamp has incorporated a circuit board within a recess in the bulb, wherein the circuit board contains connections and circuitry to control power to the lamp filament while maintaining the attachment of the bulb to the metal base, wherein the completed lamp assembly including the circuit board and the metal base maintains the external physical dimensions to fit into standard incandescent light fixtures. The circuitry on the circuit board contains performance-modifying or performance-monitoring electronic circuitry configured to reflect the restrictive size and thermal considerations while employing designs and manufacturing processes most typically found in such products.

Abstract: An incandescent light bulb life extender circuit is designed to attach to the screw base of a conventional light bulb or incorporated in series with the AC powering the bulb. The circuit employs a bidirectional semiconductor switch that reduces the brightness of the bulb marginally while significantly extending the bulb's life. The values of the life extender are selected to operate with standard available light dimmers with no undesirable flicker or compromise of reasonable brightness control. A controller consists of the life extending circuit and a) an appropriate molded insulating housing, b) electrically conductive metallic discs for making electrical contacts to a light bulb base and corresponding socket and c) selected electronic components, connected to said discs, to facilitate the intended electrical performance.

Abstract: A high density, multiple output switching power supply having internal mechanical and/or computer generated means for programming multiple operating specifications. The power supply defines a mass-produced base model, fully tested to a relevant safety or operating standard. The base model can be stocked and reprogrammed at the manufacturer or distributor locations into any one of a multitude of substantially different models, each meeting the relevant standards, that is then delivered directly to the end user.

Abstract: A high density, multiple output switching power supply having internal, but externally accessible, mechanical programmability means, or computer generated programmability, whereby a mass-produced, fully tested standard base model can be stocked and reprogrammed at the distributor locations into any one of a multitude of substantially different models that is then delivered directly to the end user.

Abstract: The present invention relates to high density electronic power supplies and more particularly switching power supplies employing a metallic enclosure and integral cooling means. The configuration employs an array of thermally conductive metal bars to optimally distribute heat from a number of dissipative elements to a thermally conductive metal element that has substantial surface area within an internally generated air stream. The thermally conductive metal element may be the metal enclosure that also acts as a heat sink or fins, both of which provide substantial surface area to the air stream.

Abstract: The present invention relates to high density electronic power supplies and more particularly switching power supplies employing a metallic enclosure and integral cooling means. The configuration employs an array of thermally conductive metal bars to optimally distribute heat from a number of dissipative elements to a thermally conductive metal element that has substantial surface area within an internally generated air stream. The thermally conductive metal element may be the metal enclosure that also acts as a heat sink or fins, both of which provide substantial surface area to the air stream.

Abstract: Transient protection apparatus and circuitry that allows a circuit being protected to operate during the transient and after the transient. Two types are included, one being a blocking type for use in severe conditions when little is known about the source of the transients and protection must be provided, and the other being a shunt suppresser type for use where the impedance of the transient or other parameters known about the transient allows such use. For the blocking type, when a transient voltage is detected, a series component (Q-1) decouples prevents the transient from reaching the circuit being protected. A charge pump (A-1) is provided that powers the circuit being protected during the duration of the transient. A shunt suppressor type provides a zener threshold (Z1) detector with a power boost provided by a MOSFET or IGBT (Q-30.

Abstract: Solid state optically coupled power switch with light induced or modified voltage applied or removed at one or more MOSFET gate and source electrode pairs to shift each MOSFET between its high and low impedance states and in various circuit arrays for ac or dc switching and/or cross points switching or mechanical Form C relay substitution or other purposes.

Abstract: The present invention relates to power relays and more particularly to optically coupled, zero-voltage switching electric power relays. Operating from logic-level signals, the device can control loads of several amperes or more at 60-400 Hz line voltages of at least 240 VAC. The invention introduces meaningful superior performance characteristics while at the same time incorporating unique cost reduction methods.

Abstract: Solid state optically coupled power switch with light induced or modified voltage applied or removed at one or more MOSFET gate and source electrode pairs to shift each MOSFET between its high and low impedance states and in various circuit arrays for ac or dc switching and/or cross points switching or mechanical Form C relay substitution or other purposes