Patents by Inventor Edward W. Jekkal

Edward W. Jekkal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5345323
    Abstract: Optical fibers (15) are supported within a bonded support member (16) having along opposite sides first and second grooves (14) which are parallel to the central axes of the fibers being supported. A first opening (22) is formed in a holder member (21) which includes a first projection (27). A cantilever spring member (23) is formed in the holder member having a second projection (27) opposite the first projection. The bonded fiber support member (16) is inserted into the opening such that the first projection engages the first groove (14) on one side, and the second projection engages the second groove (14) on the other side of the bonded support member. Thereafter, the bonded support member is locked into position and the holder biases one end of it against a polishing wheel (29) to permit polishing along a plane which is perpendicular to the axes of the optical fibers.
    Type: Grant
    Filed: August 2, 1993
    Date of Patent: September 6, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: Nagesh R. Basavanhally, Richard Borutta, Edward W. Jekkal
  • Patent number: 5337384
    Abstract: A method for interconnecting first and second optical fiber bundles (FIG. 4 ), each bundle comprising a plurality of optical fibers, comprises the steps of accurately forming substantially identical matrix arrays of apertures in first and second thin securing plates (FIG. 1, 20, 17). The use of thin plates for the securing plate makes it possible to form apertures by masking and etching with great precision, but the plates themselves have little mechanical strength. The first and second plates are aligned (by balls 24), and a first support member (31), which is mechanically rugged, is simultaneously contacted to the first securing plate (17) and to a first alignment pin (27). The first support member (31) is bonded to the first securing plate while the first securing plate (17) is in alignment with the second securing plate (20).
    Type: Grant
    Filed: July 6, 1993
    Date of Patent: August 9, 1994
    Assignee: AT&T Bell Laboratories
    Inventors: Nagesh R. Basavanhally, Richard Borutta, Edward W. Jekkal