Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.

Abstract: A device may include an inner layer comprising a polyvinylidene fluoride (PVDF) material. The device may also include a first interface layer, disposed on a first side of the inner layer, and a second interface layer, disposed on a second side of the inner layer. The first interface layer and the second interface layer may comprise a mixture of PVDF material and a scavenger component.

Abstract: A novel polymer positive temperature coefficient (PPTC) material, device, and method of fabrication. One example of polymer positive temperature coefficient (PPTC) includes a polymer matrix, the polymer matrix comprising a first polymer. The PPTC material may further include a conductive filler, disposed in the polymer matrix; and at least one polymer filler, dispersed within the polymer matrix. The at least one polymer filler may comprise a second polymer, different from the first polymer, wherein the at least one polymer comprises a first melting temperature, and wherein the second polymer comprises a second melting temperature, the second melting temperature exceeding the first melting temperature by at least 20 C.

Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.

Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.

Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.

Abstract: A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material.

Abstract: A device may include an inner layer comprising a polyvinylidene fluoride (PVDF) material. The device may also include a first interface layer, disposed on a first side of the inner layer, and a second interface layer, disposed on a second side of the inner layer. The first interface layer and the second interface layer may comprise a mixture of PVDF material and a scavenger component.

Abstract: Conductive composite compositions and circuit protection devices including a conductive composite composition are disclosed. The conductive composite composition includes a polymer material, a plurality of conductive particles, and a high melting point additive. The high melting point additive comprises at least 1% of the conductive composite, by volume of the total composition. The circuit protection device includes a body portion comprising a conductive composite composition, the conductive composite composition comprising a polymer material, a plurality of conductive particles, and at least 1%, by volume, of a high melting point additive loaded in the polymer material, and leads extending from the body portion, the leads arranged and disposed to electrically couple the circuit protection device to an electrical system. Also provided is a method of forming a conductive composite.

Abstract: Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants are provided herein. In an embodiment, a borate ester comprises boron and silicon wherein the boron is linked to the silicon by alkyl groups that are bonded via ester bonds with both the boron and the silicon. A method of fabricating a boron-comprising dopant comprises providing a borate and transesterifying the borate using a polyol-substituted silicon monomer.

Abstract: Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants are provided herein. In an embodiment, a borate ester comprises boron and silicon wherein the boron is linked to the silicon by alkyl groups that are bonded via ester bonds with both the boron and the silicon. A method of fabricating a boron-comprising dopant comprises providing a borate and transesterifying the borate using a polyol-substituted silicon monomer.

Abstract: Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.

Abstract: Compositions useful for the removal of polymeric material from substrates, such as magnetoresistive sensors, are provided. Methods of removing such polymeric material from magnetoresistive sensors and methods of manufacturing magnetoresistive sensors are also provided.

Abstract: Compositions suitable for removing polymeric material, particularly post-plasma etch polymeric material, from a substrate are provided. These compositions contain one or more quaternary ammonium silicates as the active component. Methods of removing polymeric material using these compositions are also provided.

Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.

Abstract: Compositions and methods for the removal of patterned photodefinable materials, such as photoresists and/or photoimageable dielectric materials, from substrates are provided. Such compositions and methods are useful in the manufacture of electronic devices. Methods of reworking electronic device substrates by removing patterned photodefinable material from an underlying organic film are also provided.

Abstract: Disclosed are compositions and methods for improving compatibility of imaging layers with dielectric layers. Also disclosed are methods of reducing or eliminating poisoning of photoresists during electronic device manufacture.

Abstract: The invention provides photoresists and resist preparative methods. Methods of the invention include treatment of a resist resin with methylene chloride or other organic solvent to remove low molecular weight materials. It has been found that the treated resin can be formulated into resists that provide manufactured electronic devices with significantly reduced defects.

Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.

Abstract: Disclosed are compositions and methods for providing substantially planarized surfaces in the manufacture of electronic devices. Also disclosed are compositions and methods for protecting apertures in the manufacture of electronic devices.