Patents by Inventor Edward W. Tokarsky

Edward W. Tokarsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6159895
    Abstract: A catalyst composition is disclosed which includes a p-aramid polymer supporting a catalyst agent. The composition exhibits improved catalytic activity when compared with a similar composition using m-aramid polymer as the support. The composition contemplates shaped and formed catalyst structures using p-aramid particles and fibers, as papers and fabrics, and as, for example, honeycomb and mats.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: December 12, 2000
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Theodore A. Koch, Vlodek Gabara, Edward W. Tokarsky, John J. McEvoy
  • Patent number: 5475185
    Abstract: A shielded cable is disclosed having metal coated aramid fibers as the shielding.
    Type: Grant
    Filed: April 1, 1992
    Date of Patent: December 12, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Edward W. Tokarsky
  • Patent number: 5302415
    Abstract: A process is disclosed for making metal plated PPD-T fibers wherein the plating is durable and highly conductive. The process involves contacting the fibers with an 80 to 90% sulfuric acid solution, neutralizing and washing the fibers with water, and then plating the fibers by an electroless plating process. The acid treatment of the fibers promotes adhesion between the metal and the fiber and high electrical conductivity for the plated metal.
    Type: Grant
    Filed: December 8, 1992
    Date of Patent: April 12, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Vlodek Gabara, Che-Hsiung Hsu, Edward W. Tokarsky
  • Patent number: 4729921
    Abstract: High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.
    Type: Grant
    Filed: September 17, 1985
    Date of Patent: March 8, 1988
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Edward W. Tokarsky
  • Patent number: 4698267
    Abstract: High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.
    Type: Grant
    Filed: March 13, 1986
    Date of Patent: October 6, 1987
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Edward W. Tokarsky