Abstract: Radio transceiver devices and methods are disclosed herein. An example transceiver device includes at least one processor, a plurality of radio transceivers, and a memory. The memory may store instructions that, when executed by the at least one processor, cause the transceiver device to cause the plurality of radio transceivers to scan over each of a plurality of advertisement channels during a first period; and during a second period of the scan period, cause the plurality of radio transceivers to scan over each of the plurality of advertisement channels. The instruction may further cause the transceiver device to receive a beacon data packet including beacon information that is associated with a beacon device disposed proximate to the transceiver device, and wherein the beacon data packet includes beacon information captured during the first period and the second period.

Abstract: The present invention relates to methods and compositions for transforming soybean, corn, cotton, or canola explants using spectinomycin as a selective agent for transformation of the explants. The method may further comprise treatment of the explants with cytokinin during the transformation and regeneration process.

Abstract: The present invention provides methods for the production of viable explants from mature corn seeds, wherein the explant comprises the apical portion of the embryo axis of the corn seed. The present invention also relates to methods for producing such explants and for transforming the explants with a heterologous DNA.

Abstract: Devices and methods for using separate advertisement streams in a single beacon device are disclosed herein. An example beacon device includes at least one processor, a radio transceiver, and a memory. The memory may store instructions that, when executed by the at least one processor, cause the beacon device to receive a set of beacon information captured during a scan period. The instructions may further cause the beacon device to transmit a captured beacon stream (CBS) that includes beacon information from the set of beacon information. The instructions may further cause the beacon device to transmit, to a mobile device, a waypoint beacon stream (WBS) including a protocol data unit (PDU) data payload. The PDU data payload may encode a media access control (MAC) identifier adjacent to a type field indicative of a format for heartbeat data encoded in the PDU data payload.

Abstract: An interconnect structure and a method of forming the interconnect structure are provided. Two wafers (and/or dies) are bonded together. A multi-via interconnect structure is formed extending from a backside of a first substrate to interconnect structures in the metallization layers on the first integrated circuit and the second integrated circuit. The multi-via interconnect structure may be formed by thinning a first substrate of a first wafer and forming a first opening through the first substrate. A second opening extends from the first opening to a first interconnect structure on the first wafer, and a third opening extends from the first interconnect structure on the first wafer to a second interconnect structure on the second wafer. The first, second, and third openings are filled with a conductive material, thereby forming a multi-via interconnect structure.

Abstract: An interconnect structure and a method of forming the interconnect structure are provided. Two wafers (and/or dies) are bonded together. A multi-via interconnect structure is formed extending from a backside of a first substrate to interconnect structures in the metallization layers on the first integrated circuit and the second integrated circuit. The multi-via interconnect structure may be formed by thinning a first substrate of a first wafer and forming a first opening through the first substrate. A second opening extends from the first opening to a first interconnect structure on the first wafer, and a third opening extends from the first interconnect structure on the first wafer to a second interconnect structure on the second wafer. The first, second, and third openings are filled with a conductive material, thereby forming a multi-via interconnect structure.