Abstract: Described herein are protected electrode arrays and methods of fabricating thereof. Such electrode arrays can be used in electrochemical-additive manufacturing (ECAM) systems and other systems/applications. In some examples, a protected electrode array comprises an electrode-interface circuit and an interposer bonded to the circuit, e.g., using an adhesive layer. The interposer can include an interposer base formed from silicon, glass, and other like materials suitable for operating environments. The interposer base comprises vias, which are aligned with the circuit's electrode connectors, and interposer electrodes deposited within these vias and electrically coupled to the electrode connectors. In some examples, the interposer comprises a base cover and/or electrode covers positioned over the interposer base and the interposer electrodes, respectively.

Abstract: A method of applying a material onto a substrate includes applying a first photosensitive resist layer onto a substrate, exposing a portion of the first photosensitive resist layer to a first light such that a first-layer region is defined, applying a second photosensitive resist layer directly onto the first photosensitive resist layer, and exposing a portion of the second photosensitive resist layer to a second light such that a second-layer region, at least partially overlapping the first-layer region, is defined. The method further includes developing the first photosensitive resist layer and the second photosensitive resist layer to remove the second-layer region and at least a portion of the first-layer region. An aperture is created through remaining portions of the second photosensitive layer and the first photosensitive layer such that a portion of the remaining portion of the second photosensitive layer overhangs at least part of the first-layer region.

Abstract: A method of forming an electrode array includes applying at least one first photosensitive resist layer onto a substrate, exposing a portion of the at least one first photosensitive resist layer to a first light such that a first-layer region is defined, applying at least one second photosensitive resist layer onto the at least one first photosensitive resist layer, and exposing a portion of the at least one second photosensitive resist layer to a second light such that a second-layer region, within a footprint of the first-layer region, is defined. The method further includes developing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer to remove the second-layer region and at least a portion of the first-layer region, such that an aperture is formed with an overhang portion.

Abstract: A method of forming a printhead of an electrochemical deposition system includes applying at least one first photosensitive resist layer onto a substrate including a connection circuit, exposing a portion of the at least one first photosensitive resist layer to a first light such that a first-layer region is defined, applying at least one second photosensitive resist layer onto the at least one first photosensitive resist layer, and exposing a portion of the at least one second photosensitive resist layer to a second light such that a second-layer region, at least partially overlapping the first-layer region, is defined. The method further includes developing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer to remove the second-layer region and at least a portion of the first-layer region, such that an aperture is formed with an overhang portion.

Abstract: An electrochemical-deposition printhead assembly includes a substrate made of an insulating material and including openings that extend from a top surface to a bottom surface of the substrate. The electrochemical-deposition printhead assembly also includes deposition anodes that include conductive material that fills the openings. The electrochemical-deposition printhead assembly additionally includes a backplane that is coupled to the substrate. The backplane includes a grid control circuit, which includes an array of row traces, an array of column traces, a row driver circuit, electrically coupled to the row traces, and a column driver circuit, electrically coupled to the column traces. The backplane also includes a power distribution circuit and deposition-control circuits aligned with a deposition grid. Each one of the deposition-control circuits is electrically coupled to the power distribution circuit, an associated one of the row traces, and an associated one of the column traces.

Abstract: A method of forming a printhead of an electrochemical deposition system includes applying at least one first photosensitive resist layer onto a substrate comprising a connection circuit, exposing a portion of the at least one first photosensitive resist layer to a first light such that a first-layer region is defined, applying at least one second photosensitive resist layer onto the at least one first photosensitive resist layer, and exposing a portion of the at least one second photosensitive resist layer to a second light such that a second-layer region, at least partially overlapping the first-layer region, is defined. The method further includes developing the at least one first photosensitive resist layer and the at least one second photosensitive resist layer to remove the second-layer region and at least a portion of the first-layer region, such that an aperture is formed with an overhang portion.

Abstract: Described herein are printheads for electrochemical-additive manufacturing (ECAM) comprising extended electrode interconnects and other features for preventing electrolyte ingress and protecting the electrode-interface circuits of these printheads. For example, an electrode interconnect may comprise a metal trace extending in-plane between and interconnecting two vertical (out-of-plane) conductors such that the shortest/direct distance between these vertical conductors is substantially smaller than the length/path of this metal trace. As such, the metal trace substantially increases the electrolyte migration path between these vertical conductors. Furthermore, multiple metal traces (at different levels) may be used with vertical conductors being offset from each other. Finally, electrode edges may protrude into the insulator recesses thereby preventing these edges from peeling and increasing the contact interface between the electrodes and the insulator.

Abstract: An electrochemical-deposition printhead assembly includes a substrate made of an insulating material and including openings that extend from a top surface to a bottom surface of the substrate. The electrochemical-deposition printhead assembly also includes deposition anodes that include conductive material that fills the openings. The electrochemical-deposition printhead assembly additionally includes a backplane that is coupled to the substrate. The backplane includes a grid control circuit, which includes an array of row traces, an array of column traces, a row driver circuit, electrically coupled to the row traces, and a column driver circuit, electrically coupled to the column traces. The backplane also includes a power distribution circuit and deposition-control circuits aligned with a deposition grid. Each one of the deposition-control circuits is electrically coupled to the power distribution circuit, an associated one of the row traces, and an associated one of the column traces.

Abstract: Described herein are protected electrode arrays and methods of fabricating thereof. Such electrode arrays can be used in electrochemical-additive manufacturing (ECAM) systems and other systems/applications. In some examples, a protected electrode array comprises an electrode-interface circuit and an interposer bonded to the circuit, e.g., using an adhesive layer. The interposer can include an interposer base formed from silicon, glass, and other like materials suitable for operating environments. The interposer base comprises vias, which are aligned with the circuit's electrode connectors, and interposer electrodes deposited within these vias and electrically coupled to the electrode connectors. In some examples, the interposer comprises a base cover and/or electrode covers positioned over the interposer base and the interposer electrodes, respectively.

Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: There is set forth herein: an implant adapted for implantation in a user having a neocortex at least part of which has been made responsive to light, the neocortex including a plurality of columns forming an array of cortical columns capable of description by a cortical map characterizing, identifying or defining a location or topographical relationship and placement for respective ones of the plurality of columns; wherein the implant includes an emitter array; wherein the emitter array includes a plurality of emitters, wherein respective ones of the plurality of emitters are configured to emit light toward the array of cortical columns.

Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: 3D metal printhead assembly method of manufacture that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: An antenna arrangement is disclosed, comprising a first body comprising a communications device including an antenna for transmitting and/or receiving signals via the antenna, and a second body comprising a conductive parasitic element for electromagnetic coupling with the antenna. The first body is physically separate from, or is removably attachable from, the second body. An associated method of transmitting and/or receiving signals is further disclosed.

Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: 3D metal printhead assembly method of manufacture that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Abstract: Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.