Patents by Inventor Edwin Bradley

Edwin Bradley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060182939
    Abstract: A method (50) of forming a solder mask on a portion of a module (40) using for example LTCC technology includes the steps of forming (52) a multilayered ceramic substrate (20) with exposed metallization forming solder pads (28 or 31), masking (54 or 56) the solder pads by placing an additional ceramic layer (22 or 32) on the substrate that at least covers at least a portion of periphery of the solder pad using the LTCC process. The method can further include applying (58 or 60) solder (36) to a portion of the solder pad not covered by the solder mask (22) and placing a printed circuit board (34) having a different coefficient of thermal expansion than the multilayer ceramic substrate on the multilayer ceramic substrate to form the module before reflowing. The module can then be reflowed to form the module without cracks.
    Type: Application
    Filed: February 11, 2005
    Publication date: August 17, 2006
    Applicant: Motorola, Inc.
    Inventors: Vahid Goudarzi, Edwin Bradley, Kinzy Jones, Gustavo Leizerovich
  • Publication number: 20060021466
    Abstract: This invention is to a mixed alloy lead-free solder paste, a method of making the solder paste, and a method of using the solder paste. The solder paste comprises particles of a first alloy and a second alloy, mixed in a flux. The liquidus temperature of the first alloy and the liquidus temperature of the second alloy differ by not greater than about 15° C.
    Type: Application
    Filed: August 22, 2005
    Publication date: February 2, 2006
    Inventors: Vahid Goudarzi, Edwin Bradley, Brian Fariello
  • Publication number: 20050121496
    Abstract: A solid solder element (106), such as a solder perform, is attached onto a contact surface of interest (102), such as a heat sink using and adhesive material (104). Placement of the adhesive material overcomes alignment and registration issues that may interfere with good contact to components (108), such as transistors, during the manufacturing/assembly process, such as a reflow process.
    Type: Application
    Filed: February 23, 2004
    Publication date: June 9, 2005
    Inventors: Kevin Farrell, Edwin Bradley, Hal Canter, Gene Kim, David McClintock
  • Patent number: 5901486
    Abstract: A menu board for supporting elongated menu strips of varying heights is disclosed having adjustable guide rails supported in a frame. The frame includes side members incorporating guide rail support elements disposed along the length of the side members to releasably engage the guide rails. The guide rails are selectively positionable along the length of the side members to provide adjustable spacing between adjacent pairs of guide rails. The menu strips include descriptive indicia such as product names and pricing information and are disposed between and supported by adjacent pairs of the guide rails.
    Type: Grant
    Filed: June 9, 1997
    Date of Patent: May 11, 1999
    Assignee: LSI Industries Inc.
    Inventors: Scott W. Sharon, James Edwin Bradley