Abstract: Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

Abstract: Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

Abstract: Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzenes are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamono-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

Abstract: Resinous condensation polymers of polycarboxylic acid compounds and aromatic diprimary amines comprising diamino-t-butylbenzens are described. In particular, film-forming polyamides, polyimides and polyamide-imides and their copolymers made using diamino-t-butylbenzenes which have amino groups meta or para to each other on a benzene ring are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high glass transition temperature, excellent thermal stability, and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

Abstract: Soluble, film-forming, polyamides, polyimides, and polyamide-imides and their copolymers made using 3,5-diamino-t-butylbenzene are described. These polymers have some solubility in organic solvents such as N-methylpyrrolidone, a high Tg, excellent thermal stability, lower density and lower moisture uptake and are useful in films, fibers and composites, and in the electronics industry as electrical component substrates, protective coatings, interlevel dielectrics and the like.

Abstract: Novel polyamides are prepared for itaconic acid, other diacids and diamines. These polyamides are useful as molded objects, fibers, films, laminates and coatings.

Abstract: Novel polyamides are prepared from itaconic acid and diamines. These polyamides are useful as molded objects, fibers, films, laminates and coatings.

Abstract: Novel terpolymers of the amide-imide type are prepared from tricarboxylic-acid-anhydride derivatives, aromatic diamino quinones and two other wholly-aromatic primary diamines. The novel terpolymers are useful for preparing molded articles of superior properties at injection molding temperatures lower than required for molding the amide-imide copolymers disclosed in the prior art.

Abstract: Copolymers of the amide-imide variety are made from a mixture of two or more largely- or wholly-aromatic primary diamines and an aromatic polycarboxylic-acid-anhydride derivative. A process for fabricating molded articles from these copolymers is described which comprises heat treating the copolymers from about 300.degree. to about 700.degree. F. and then applying a pressure of about 200 p.s.i. to about 30,000 p.s.i. to said partially cured material which has been preheated to a temperature within the range of about 200.degree. to about 750.degree. F. and subsequentlyejecting the coalesced polyamide-imide in the form of a shaped article.