Abstract: A vacuum storage cassette for semiconductor wafers has one or more valves to allow the cassette to be evacuated, backfilled, and opened to the surround atmosphere and resealed without the need for a vacuum load-lock chamber.

Abstract: A vacuum storage cassette for semiconductor wafers has one or more valves to allow the cassette to be evacuated, backfilled, and opened to the surround atmosphere and resealed without the need for a vacuum load-lock chamber.

Abstract: A system and method for determining the pattern development endpoint of a photoresist polymer during spin/spray processing of a semiconductor wafer utilizes the optical transmission of the waster developer liquid during the pattern develop process to determine when the developing is completed.

Abstract: An optical analyzer and a developer recirculation system is used to determine the amount of photoresist polymer dissolved in a quantity of developer solution and the sensor output signal is utilized by a control computer to control the admission of fresh developer solution to replace used developer and maintain a fixed level of dissolved photoresist polymer to keep the developer bath at a fixed level of chemical activity.

Abstract: A reflective beam of light is used to analyze the optical transmission properties of a developer fluid during puddle develop of photoresist polymer for detercting the process endpoint.

Abstract: A method and apparatus is provided for removing submicron sized particles from the surface of a silicon semiconductor wafer (38). Conventional cleaning methods are capable of only removing particles that are about 1 micron or larger in size. The present invention provides a way to increase the submicron particles in size so that they are removable by the known methods. The silicon semiconductor wafer (38) is cooled by a refrigeration unit (36) or by exposure to liquid nitrogen (74). The cooled wafer (38) is then exposed to a condensable material (42) which is allowed to condense on the surface of the wafer (38). The condensable material will surround any particles that are on the surface and cause them to grow in size due to the formation of frozen crystals. Without allowing the crystals to melt, the enlarged particles then are removed by any of the known methods.

Abstract: A transport mechanism (40) for transporting a semiconductor slice cassette between a clean carrier (10) and a process machine comprises a housing (41) having a forward portion (42) positioned in the people-occupied area of the clean room and a rear portion (46) positioned in the process machine area aerodynamically isolated from people. A moveable glider plate (50) is adapted to receive the carrier (10) and is initially positioned in an aperture provided in the upper surface of forward portion (42). A gearing mechanism (54) is provided which cooperates with glider plate (50) to move the semiconductor slice cassettes mounted on the base of carrier (10) between forward portion (42) and rear portion (46).

Abstract: A portable carrier (10) for storage and transportation of semiconductor slice cassettes in a clean room environment which shields the semiconductor slices from VLF air in people occupied areas includes a base (12), a pair of spring-mounted cradles (14) mounted on base (12) for supporting the semiconductor slice cassette and a cover (16) for disposal on base (12) to provide a sealed volume. Carrier (10) also includes a latch (20) for removably coupling cover (16) onto base (12). Latch (20) includes a handle (22) at the terminal end thereof to facilitate handling and transporting of carrier (10) when cover (16) is locked in place on base (12). A latch tube (24) is mounted proximate the center of base (12) and cooperates with latch (20) to couple cover (16) onto base (12).

Abstract: A transport mechanism (40) for transporting a semiconductor slice cassette between a clean carrier (10) and a process machine comprises a housing (41) having a forward portion (42) positioned in the people-occupied area of the clean room and a rear portion (46) positioned in the process machine area aerodynamically isolated from people. A moveable glider plate (50) is adapted to receive the carrier (10) and is initially positioned in an aperture provided in the upper surface of forward portion (42). A gearing mechanism (54) is provided which cooperates with glider plate (50) to move the semiconductor slice cassettes mounted on the base of carrier (10) between forward portion (42) and rear portion (46).