Patents by Inventor Edwin J. Stanfield

Edwin J. Stanfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Efficient solid-state high frequency power amplifier structure
    Patent number: 6160454
    Abstract: A power amplifier uses a plurality of solid-state amplifiers (FIGS. 2 and 3, 140) arranged in a parallel manner to form a power amplifier module (10). Each solid-state amplifier is adhered to a low thermal expansion insert (130). The insert is then coupled to a low cost aluminum substrate in order to carry the excess heat from each solid-state amplifier (140) to the aluminum housing. The power outputs from the solid-state amplifiers from each module are combined with the power outputs from other modules using electroformed waveguide combiners (FIG. 1, 30, 40).
    Type: Grant
    Filed: October 19, 1998
    Date of Patent: December 12, 2000
    Assignee: Motorola, Inc.
    Inventors: Kenneth V. Buer, Dean L. Cook, Richard Torkington, Edwin J. Stanfield, Phillip James Denisuk