Patents by Inventor Edwin Jack Stanfield

Edwin Jack Stanfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High power block upconverter
    Patent number: 7035617
    Abstract: A system and method for high power block upconversion having a stand-alone and surface-mountable component is provided. The HP-BUC system of the invention provides a “drop-in” component capable of mixing a local oscillator signal with an IF signal to produce an RF signal in the millimeter-wave and higher bands. In addition, the HP-BUC provides filtering of unwanted spurious signals and requires no further signal amplification prior to transmission, for example in a satellite communications system.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: April 25, 2006
    Assignee: U.S. Monolithics, L.L.C.
    Inventors: Kenneth V. Buer, Richard S. Torkington, Edwin Jack Stanfield
  • Modular high power solid state amplifier
    Patent number: 6542035
    Abstract: A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: April 1, 2003
    Assignee: U.S. Monolithics, L.L.C.
    Inventors: Dean L. Cook, Michael R. Lyons, John Martin Peitz, Edwin Jack Stanfield
  • High power block upconverter
    Publication number: 20020102959
    Abstract: A system and method for high power block upconversion having a stand-alone and surface-mountable component is provided. The HP-BUC system of the invention provides a “drop-in” component capable of mixing a local oscillator signal with an IF signal to produce an RF signal in the millimeter-wave and higher bands. In addition, the HP-BUC provides filtering of unwanted spurious signals and requires no further signal amplification prior to transmission, for example in a satellite communications system.
    Type: Application
    Filed: January 29, 2002
    Publication date: August 1, 2002
    Inventors: Kenneth V. Buer, Richard S. Torkington, Edwin Jack Stanfield
  • Modular high power solid state amplifier
    Publication number: 20020084852
    Abstract: A modular high power solid state amplifier and method of assembly, manufacture and use are herein disclosed. The high power amplifier includes a number of amplifiers, a DC board having flexible interconnects, a RF cover including an interlocking RF input, a RF board, a chassis, and a top cover; thereby providing an encased stand-alone solid state amplifier. The solid state components, angled designs, and piggyback topology of the invention provide a compact, efficient, integrated high power amplifier device.
    Type: Application
    Filed: December 28, 2000
    Publication date: July 4, 2002
    Inventors: Dean L. Cook, Michael R. Lyons, John Martin Peitz, Edwin Jack Stanfield