Patents by Inventor Edwin James Harris
Edwin James Harris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7843308Abstract: A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.Type: GrantFiled: February 26, 2007Date of Patent: November 30, 2010Assignee: Littlefuse, Inc.Inventors: Timothy Pachla, Edwin James Harris, Tushar Vyas
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Patent number: 7609141Abstract: A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.Type: GrantFiled: February 26, 2007Date of Patent: October 27, 2009Assignee: Littelfuse, Inc.Inventors: Edwin James Harris, Timothy Pachla, Tushar Vyas
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Patent number: 7258819Abstract: The present invention provides an improved voltage variable material (“VVM”). More specifically, the present invention provides an improved printed circuit board substrate, an improved device having circuit protection an improved data communications cable having circuit protection and a method for mass producing devices employing the VVM substrate of the present invention. The VVM substrate eliminates the need for an intermediate daughter or carrier board by impregnating conductive particles and possibly semiconductive and/or insulative particles associated with known volatage variable materials into the varnish or epoxy resin associated with known printed circuit board substrates.Type: GrantFiled: October 11, 2001Date of Patent: August 21, 2007Assignee: Littelfuse, Inc.Inventor: Edwin James Harris, IV
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Patent number: 7233474Abstract: An electrical protection device is provided. The device can be removably attached to or mounted inside of a power source, such as a vehicle, e.g., automobile, battery and can employ a replaceable fuse element. The device includes an overcurrent protection element, such as a fuse element, and provides any one or more of the following types of electrical protection: (i) overcurrent protection; (ii) accident or catastrophic event power cutout protection; and (iii) load dump protection. The system is configurable to protect certain vehicle electrical components from an overcurrent and allow others to operate independent of the overcurrent protection. Systems and methods employing the protection device are also illustrated and discussed.Type: GrantFiled: November 24, 2004Date of Patent: June 19, 2007Assignee: Littelfuse, Inc.Inventors: William P. Brown, Edwin James Harris, Jeffrey John Ribordy
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Patent number: 7202770Abstract: The present invention provides overvoltage circuit protection. Specifically, the present invention provides a voltage variable material (“VVM”) that includes an insulative binder that is formulated to intrinsically adhere to conductive and nonconductive surfaces. The binder and thus the VVM is self-curable and may be applied to an application in the form of an ink, which dries in a final form for use. The binder eliminates the need to place the VVM in a separate device or for separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device.Type: GrantFiled: April 8, 2003Date of Patent: April 10, 2007Assignee: Littelfuse, Inc.Inventors: Edwin James Harris, Scott Davidson, David Perry, Steven J. Whitney
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Patent number: 7183891Abstract: A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.Type: GrantFiled: October 5, 2004Date of Patent: February 27, 2007Assignee: Littelfuse, Inc.Inventors: Edwin James Harris, Tushar Vyas, Timothy Pachla, James A. Colby
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Patent number: 7132922Abstract: A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.Type: GrantFiled: December 23, 2003Date of Patent: November 7, 2006Assignee: Littelfuse, Inc.Inventors: Edwin James Harris, Tushar Vyas, Stephen J. Whitney
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Publication number: 20040201941Abstract: A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device. In one embodiment, the VVM includes doped semiconductive particles having a core, such which can be silicon, and an inert coating, which can be an oxide. The particles are mixed in the binder with conductive particles.Type: ApplicationFiled: December 23, 2003Publication date: October 14, 2004Inventors: Edwin James Harris, Tushar Vyas, Stephen J. Whitney
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Publication number: 20030218851Abstract: The present invention provides overvoltage circuit protection. Specifically, the present invention provides a voltage variable material (“VVM”) that includes an insulative binder that is formulated to intrinsically adhere to conductive and nonconductive surfaces. The binder and thus the VVM is self-curable and may be applied to an application in the form of an ink, which dries in a final form for use. The binder eliminates the need to place the VVM in a separate device or for separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid (FR-4) laminate, a polyimide or a polymer. The VVM can also be directly applied to different types of substrates that are placed inside a device.Type: ApplicationFiled: April 8, 2003Publication date: November 27, 2003Inventors: Edwin James Harris, Scott Davidson, David Perry, Stephen J. Whitney
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Publication number: 20030071245Abstract: The present invention provides an improved voltage variable material (“VVM”). More specifically, the present invention provides an improved printed circuit board substrate, an improved device having circuit protection an improved data communications cable having circuit protection and a method for mass producing devices employing the VVM substrate of the present invention. The VVM substrate eliminates the need for an intermediate daughter or carrier board by impregnating conductive particles and possibly semiconductive and/or insulative particles associated with known volatage variable materials into the varnish or epoxy resin associated with known printed circuit board substrates.Type: ApplicationFiled: October 11, 2001Publication date: April 17, 2003Inventor: Edwin James Harris
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Patent number: 6547597Abstract: An apparatus and method for incorporating surface mount components into connectors. In an embodiment, an apparatus that houses a printed circuit board having a surface mount component is provided. The apparatus includes a body. A plurality of leads are fixed to the body so that an external electrical device is enabled to electrically communicate with the leads. A clip extends from each lead and receives an end of a printed circuit board.Type: GrantFiled: July 10, 2001Date of Patent: April 15, 2003Assignee: Littelfuse, Inc.Inventor: Edwin James Harris, IV
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Publication number: 20030013344Abstract: An apparatus and method for incorporating surface mount components into connectors. In an embodiment, an apparatus that houses a printed circuit board having a surface mount component is provided. The apparatus includes a body. A plurality of leads are fixed to the body so that an external electrical device is enabled to electrically communicate with the leads. A clip extends from each lead and receives an end of a printed circuit board.Type: ApplicationFiled: July 10, 2001Publication date: January 16, 2003Inventor: Edwin James Harris
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Patent number: 6351011Abstract: A number of integrated circuit dies having on board protection against electrical overstress (EOS) transients are provided. Generally, the devices have an integrated circuit die with an outer periphery and a functional die area. A plurality of conductive input/output pads are formed on the integrated circuit die. Typically, a first conductive guard rail is disposed on the integrated circuit die and forms a gap between each one of the input/output pads. A voltage variable material is disposed in the gaps between the conductive guard rail and the input/output pads. Typically, a plurality of electrical leads are electrically connected to a respective one of the plurality of conductive input/output pads. At normal operating voltages, the voltage variable material is non-conductive. However, in response to an EOS transient, the voltage variable material switches to a low resistance state, providing a conductive path between the conductive guard rail and the input/output pads.Type: GrantFiled: January 12, 2000Date of Patent: February 26, 2002Assignee: Littlefuse, Inc.Inventors: Stephen J. Whitney, Edwin James Harris, IV, Jeffrey S. Niew, Michael J. Weber
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Patent number: 5977860Abstract: A surface-mount fuse for protecting a circuit, which includes a substrate having first and second surfaces, each surface having first, second, third, and fourth ends, the substrate also having first, second, third, and fourth sides. The fuse includes a metal strip attached to the first surface of the substrate with a layer of adhesive material, the layer of adhesive material being disposed between the metal strip and the first surface of the substrate, the metal strip having a first connection region, a second connection region, and a non-linear fuse link therebetween. The fuse further includes first and second wire leads, the first wire lead being conductively connected to the first connection region and horizontally projecting away from the first connection region, the second wire lead being conductively connected to the second connection region and horizontally projecting away from the second connection region, for connecting the fuse to the remainder of the circuit.Type: GrantFiled: February 21, 1997Date of Patent: November 2, 1999Assignee: Littelfuse, Inc.Inventors: Steven Francis Ulm, Jr., Edwin James Harris, IV, Matthew Michael Rybka
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Patent number: 5699032Abstract: A surface-mount fuse for protecting a circuit, includes a substrate having first and second surfaces, each surface having first, second, third, and forth ends, the substrate also having first, second, third, and fourth sides. The fuse also includes a metal strip evenly attached to the first surface of the substrate with a layer of adhesive material, the layer of adhesive material being disposed between the metal strip and the first surface of the substrate, the metal strip having a first connection region, a second connection region, and a non-linear fuse link therebetween.Type: GrantFiled: June 7, 1996Date of Patent: December 16, 1997Assignee: Littelfuse, Inc.Inventors: Steven Francis Ulm, Jr., Edwin James Harris, IV, Matthew Michael Rybka
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Patent number: D559203Type: GrantFiled: November 14, 2006Date of Patent: January 8, 2008Assignee: Littelfuse, Inc.Inventors: Edwin James Harris, IV, Michael Schlaak
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Patent number: D577687Type: GrantFiled: November 8, 2007Date of Patent: September 30, 2008Assignee: Littelfuse, Inc.Inventors: Edwin James Harris, IV, Michael Schlaak
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Patent number: D577688Type: GrantFiled: February 22, 2008Date of Patent: September 30, 2008Assignee: Littelfuse, Inc.Inventors: Edwin James Harris, IV, Michael Schlaak
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Patent number: D581881Type: GrantFiled: July 16, 2008Date of Patent: December 2, 2008Assignee: Littelfuse, Inc.Inventors: Edwin James Harris, IV, Michael Schlaak