Patents by Inventor Edwin John Nealis

Edwin John Nealis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190363415
    Abstract: A circulator includes a substrate having a blind hole. The substrate has one or more dielectric layers and one or more conductive layers, including a top conductive layer on a top surface of the substrate. The circulator includes a plurality of conductive microstrips formed on the top conductive layer on the top surface of the substrate and a ferrite disk positioned within the blind hole. A top surface of the ferrite disk is flush with a top surface of the plurality of conductive microstrips. The circulator further includes a flat metal film coupling a top surface of the ferrite disk to the conductive microstrips disposed on the top surface of the substrate.
    Type: Application
    Filed: November 14, 2017
    Publication date: November 28, 2019
    Inventors: Ying SHEN, Zhou LI, Zhiping FENG, Edwin John NEALIS
  • Patent number: 9954265
    Abstract: An antenna coupling device is disclosed. The device includes a first isolator that includes an input port and an output port and a first circulator that includes a first port, a second port, and a third port. The first port of the first circulator is coupled with the output port of the first isolator; and the second port of the first circulator is configured for coupling with a first antenna. The device also includes a second isolator that includes an input port and an output port. The input port of the second isolator is coupled with the third port of the first circulator.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: April 24, 2018
    Assignee: ZTE CORPORATION
    Inventors: Ying Shen, Edwin John Nealis, Zhuo Li, Zhiping Feng, Thanh Hung Nguyen
  • Publication number: 20160149283
    Abstract: An antenna coupling device is disclosed. The device includes a first isolator that includes an input port and an output port and a first circulator that includes a first port, a second port, and a third port. The first port of the first circulator is coupled with the output port of the first isolator; and the second port of the first circulator is configured for coupling with a first antenna. The device also includes a second isolator that includes an input port and an output port. The input port of the second isolator is coupled with the third port of the first circulator.
    Type: Application
    Filed: November 24, 2015
    Publication date: May 26, 2016
    Inventors: Ying SHEN, Edwin John NEALIS, Zhuo LI, Zhiping FENG, Thanh Hung NGUYEN
  • Patent number: 8395256
    Abstract: Microwave or millimeter wave system packaging having a system with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: March 12, 2013
    Assignee: Harris Stratex Networks Operating Corporation
    Inventors: Ronald D. Boesch, Edwin John Nealis, Costel Nicolae
  • Publication number: 20080188098
    Abstract: Microwave or millimeter wave module packaging having a module with a baseplate, transition board and cover. The baseplate includes microwave or millimeter wave components attached thereto. The transition board includes a first connector attached to a first side thereof and operatively connected to the components, and a second connector attached to a second side thereof and operatively connected to the components through the board. The cover and baseplate form a cavity containing the board and components, and the second connector may be operatively connected to a third connector such as a printed circuit board disposed outside of the cavity and on a higher level assembly. The transition board may further include a fourth connector operatively connected to the components for providing a signal to an external component or device or receiving a signal from an external component or device.
    Type: Application
    Filed: February 2, 2007
    Publication date: August 7, 2008
    Applicant: Harris Stratex Networks, Inc.
    Inventors: Ronald D. Boesch, Edwin John Nealis, Costel Nicolae
  • Patent number: 6629365
    Abstract: A method of providing environmental protection to an electronic component includes placing an electromagnetic shield having at least one cavity in contact with a circuit board having electrical components thereon so as to substantially enclose at least a first compartment between the circuit board and the shield, the shield includes at least one entry hole connecting to the first compartment. A conformal coating is applied by introducing the conformal coating into the first compartment through the entry hole while holding the shield in contact with the circuit board so that the coating is applied to the exposed portions of the circuit board within the compartment, but not applied to portions of the circuit board contacted by the shield. An electrically conductive gasket may be positioned between and in contact with both the circuit board and the shield before the applying of the conformal coating.
    Type: Grant
    Filed: February 7, 2001
    Date of Patent: October 7, 2003
    Assignee: Ericsson Inc.
    Inventors: Quentin Scott Denzene, Edwin John Nealis
  • Patent number: 6618250
    Abstract: An electronics enclosure includes a mounting bracket adapted to mount to a support structure, a heat absorption module adapted to mount to the mounting bracket, and a housing to contain electronic equipment. The housing is adapted to mount alternatively to either the mounting bracket or the heat absorption module dependent upon solar loading conditions.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: September 9, 2003
    Assignee: Ericsson Inc.
    Inventor: Edwin John Nealis
  • Publication number: 20030043547
    Abstract: An electronics enclosure includes a mounting bracket adapted to mount to a support structure, a heat absorption module adapted to mount to the mounting bracket, and a housing to contain electronic equipment. The housing is adapted to mount alternatively to either the mounting bracket or the heat absorption module dependent upon solar loading conditions.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 6, 2003
    Inventor: Edwin John Nealis
  • Patent number: 6301123
    Abstract: A card module includes a circuit board with a front panel secured along one edge, and a board extractor catch mounted to the front panel. The front panel includes a keyhole. The board extractor catch mounts in the keyhole so that the board extractor catch completely covers the keyhole to prevent air flow through the keyhole. The outer end of the board extractor catch includes a tool-receiving opening to engage a board extracting tool.
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: October 9, 2001
    Assignee: Ericsson INC
    Inventors: Edwin John Nealis, Quentin Scott Denzene
  • Patent number: 6264480
    Abstract: An RF emissions shield for grounding a chassis to an associated connector mounted on a backplane includes a shield body, mounting means for securing the shield body to the backplane, and grounding means for electrically connecting the shield body to the connector. At least one spring member is integral with the shield body and is adapted to engage the chassis such that the spring member is biased against the chassis. Preferably, the at least one spring member includes a plurality of curved, resilient fingers extending from an edge of the shield body. The mounting means may include an aperture defined in the shield body, the aperture sized and configured to receive the connector such that at least an engagement portion of the shield body along the aperture engages the connector.
    Type: Grant
    Filed: June 16, 1999
    Date of Patent: July 24, 2001
    Assignee: Ericsson Inc.
    Inventors: Edwin John Nealis, Quentin Scott Denzene
  • Publication number: 20010004316
    Abstract: An electromagnetic shield including at least one entry hole is placed in contact with a circuit board, thereby substantially enclosing a compartment. With the shield and circuit board held together, conformal coating is introduced into the compartment through the entry hole. The conformal coating coats the exposed portions of the circuit board within the compartment, but does not coat the portions of the circuit board contacted by the shield. The circuit board may include ground traces that divide the circuit board into sections. An optional electrically conductive gasket may be used between the ground traces and the shield to provide good electrical contact between the shield and the circuit board. In addition, a connector seal may be used to form a barrier preventing entry of environmental contaminants into critical connector interface areas. The connector seal is inserted into the forwardly facing pin cavity of a male connector so that the male pins pierce through the connector seal.
    Type: Application
    Filed: February 7, 2001
    Publication date: June 21, 2001
    Inventors: Quentin Scott Denzene, Edwin John Nealis
  • Patent number: 6219258
    Abstract: An electromagnetic shield including at least one entry hole is placed in contact with a circuit board, thereby substantially enclosing a compartment. With the shield and circuit board held together, conformal coating is introduced into the compartment through the entry hole. The conformal coating coats the exposed portions of the circuit board within the compartment, but does not coat the portions of the circuit board contacted by the shield. The circuit board may include ground traces that divide the circuit board into sections. An optional electrically conductive gasket may be used between the ground traces and the shield to provide good electrical contact between the shield and the circuit board. In addition, a connector seal may be used to form a barrier preventing entry of environmental contaminants into critical connector interface areas. The connector seal is inserted into the forwardly facing pin cavity of a male connector so that the male pins pierce through the connector seal.
    Type: Grant
    Filed: January 29, 1999
    Date of Patent: April 17, 2001
    Assignee: Ericsson Inc.
    Inventors: Quentin Scott Denzene, Edwin John Nealis
  • Patent number: D796491
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: September 5, 2017
    Assignee: ZTE CORPORATION
    Inventors: Edwin John Nealis, Ying Shen, Thanh Hung Nguyen