Patents by Inventor Edwin L. Tom

Edwin L. Tom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of breaking and separating a wafer into die using a multi-radii dome
    Patent number: 6248648
    Abstract: A method and apparatus (10) for breaking a wafer (24) into die (26) having a high aspect ratio. In one embodiment, a multi-radii dome (12) is utilized to controllably break the wafer in two directions. The two different dome curvatures (R1, R2) provide an even, controlled, force along the kerfs in both the X-direction and the Y-direction. In another embodiment, a cylindrical dome (80) being curved (R3) in the Y-direction and flat in the X-direction is used to break a wafer into die having exceptionally high aspect ratios. The present invention reduces the likelihood of die fracture in the long dimension during the wafer break process. The wafer (24) is mounted on stretchable wafer tape (18) during the break process to prevent the die edges from contacting and rubbing with one another after the break process. The present invention allows separation of die of exceptionally large aspect ratios such as those having a 1:25 aspect ratio.
    Type: Grant
    Filed: March 29, 1999
    Date of Patent: June 19, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Robert G. McKenna, R. Scott Croff, Edwin L. Tom
  • Method and apparatus for breaking and separating a wafer into die using a multi-radii dome
    Patent number: 6184063
    Abstract: A method and apparatus (10) for breaking a wafer (24) into die (26) having a high aspect ratio. In one embodiment, a multi-radii dome (12) is utilized to controllably break the wafer in two directions. The two different dome curvatures (R1, R2) provide an even, controlled, force along the kerfs in both the X-direction and the Y-direction. In another embodiment, a cylindrical dome (80) being curved (R3) in the Y-direction and flat in the X-direction is used to break a wafer into die having exceptionally high aspect ratios. The present invention reduces the likelihood of die fracture in the long dimension during the wafer break process. The wafer (24) is mounted on stretchable wafer tape (18) during the break process to prevent the die edges from contacting and rubbing with one another after the break process. The present invention allows separation of die of exceptionally large aspect ratios such as those having a 1:25 aspect ratio.
    Type: Grant
    Filed: November 20, 1997
    Date of Patent: February 6, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Robert G. McKenna, R. Scott Croff, Edwin L. Tom