Patents by Inventor Edwin Lawrence

Edwin Lawrence has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer backing insert for free mount semiconductor polishing apparatus and process
    Patent number: 5948699
    Abstract: A wafer backing insert for use in a free mount semiconductor polishing apparatus and process is disclosed wherein the wafer backing insert behind the semiconductor substrate has a diameter less than the diameter of the semiconductor substrate being polished to allow the removal of material at the edge of the substrate to be less than the overall average removal of material across the entire substrate. In a preferred embodiment, the process of the present invention utilizing a wafer backing insert having a diameter less than the diameter of the semiconductor substrate being polished is used in combination with a first polishing step utilizing a conventional wafer backing insert to control the resulting thickness and overall TTV of the polished substrate.
    Type: Grant
    Filed: November 21, 1997
    Date of Patent: September 7, 1999
    Assignee: SiBond, L.L.C.
    Inventors: Edwin Lawrence, Iqbal K. Bansal