Abstract: A system and method directed to testing various communication signals and related components in a communications network. In one embodiment of the invention, a first set of data about a signal is collected when the signal is at an origin point in the communications network. Further, a second set of data about the signal is collected when the signal is at a destination point in the communications network. These two snapshots of the signal in the system can then be analyzed to determine a quality measurement based on a comparison of the first set of data and the second set of data. With such a testing method and system, various signals throughout a communications network can be tested at analyzed at any point n the system and trouble spots or high traffic areas in the communications network can be identified more quickly.

Abstract: The invention relates to a high frequency board-to-board connector for interconnecting electronic sub-assemblies. The high frequency board-to-board connector includes a row of conductive pins received in an insulative housing for connecting with receptacles of a design. Two discrete electronic sub-assemblies, for example PCBs, can be mechanically and electrically connected without the need for a gender male connector on one PCB and a corresponding gender female connector on the other PCB. A plurality of follower arms spaced apart along the grounding plate facilitates contact with a ground plane in the design to form a ground path. The ground path reduces electromagnetic coupling between any pair of conductive pins and consequentially lowering cross-talk noise. Furthermore, inductive parasitics of the conductive pins is reduced, further facilitating high frequency operations.