Abstract: A semiconductor package is provided including a die bearing a plurality of bonding pads and a substrate connected to the die by a connecting agent, the substrate including a plurality of conductive traces forming a wiring pattern, a plurality of vias forming a matrix, and an opening at a position corresponding to the plurality of bonding pads. A plurality of conductive elements fill the vias and at least one trace electrically connected to a conductively filled via disposed adjacent a first side of the tape window is routed to a second side of the tape window to form a beam lead projecting into the tape window from the second side. The beam lead is electrically connected to one of the bonding pads.