Abstract: A solderless connector especially suited for interconnecting a flexible circuit to another circuit or component, either rigid or flexible, is presented. The solderless connector of the present invention utilizes the pressure mating of contact areas with the added advantage of a wiping or cleaning action on the contacting surfaces. In one embodiment of the present invention, this wiping action is achieved by bending or crimping the two layers adjacent to the contact areas, thereby causing them to have mutual relative sliding motion over each other as they are being pressed into contact therebetween. In another embodiment, the bending or crimping of the flexible circuit layers is accomplished in the structure of the solderless connector itself.