Patents by Inventor Edwin R. Smith

Edwin R. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11453640
    Abstract: Disclosed are compounds which may be utilized to inhibit transcription by RNA Polymerase II (Pol II), and in particular to disrupt the Super Elongation Complex (SEC). The compounds may be utilized in pharmaceutical compositions and methods for treating diseases and disorders associated with the biological activity of SEC, and in particular, diseases and disorders that are associated with high levels of expression of genes whose expression is SEC-dependent and that promote, support, or otherwise are required for the disease or disorder such as cancers.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: September 27, 2022
    Assignee: Northwestern University
    Inventors: Ali Shilatifard, Kaiwei Liang, Edwin R. Smith, Gary E. Schiltz, Rama K. Mishra, Kristen Stoltz
  • Publication number: 20210094907
    Abstract: Disclosed are compounds which may be utilized to inhibit transcription by RNA Polymerase II (Pol II), and in particular to disrupt the Super Elongation Complex (SEC). The compounds may be utilized in pharmaceutical compositions and methods for treating diseases and disorders associated with the biological activity of SEC, and in particular, diseases and disorders that are associated with high levels of expression of genes whose expression is SEC-dependent and that promote, support, or otherwise are required for the disease or disorder such as cancers.
    Type: Application
    Filed: March 21, 2019
    Publication date: April 1, 2021
    Inventors: Ali Shilatifard, Kaivvei Liang, Edwin R. Smith, Gary E. Schiitz, Rama K. Mishra, Kristen Stoltz
  • Patent number: 5434010
    Abstract: Biaxially stretched, heat shrinkable monolayer and multilayer films comprising very low density polyethylene terpolymers of monomers (a), (b) and (c), where (a) comprises ethylene, (b) comprises a C.sub.6 -C.sub.8 alpha-olefin and (c) comprises 1-butene or 1-hexene, have a very good combination of physical properties and processability including high shrinkage values and puncture resistance.
    Type: Grant
    Filed: May 12, 1993
    Date of Patent: July 18, 1995
    Assignee: Viskase Corporation
    Inventors: Edwin R. Smith, Jeffrey M. Schuetz, Stanley Lustig
  • Patent number: 5342054
    Abstract: A golf practice apparatus provides recording and instant playback of video images of a golfer's swing. A plurality of color video cameras are preferably employed to obtain video images of a swing from different angles. A video processing and storage unit digitally stores the images in memory for instant replay. Image processing and recording is automatically initiated when a golf ball is placed on a designated hitting area through the use of an infrared camera and image processing software that detects a golf ball in the IR camera's image. The IR camera is also used in conjunction with an IR flash unit to obtain snapshot images of a club head and ball just before and just after the golf club hits the ball. An optical sensor array is positioned adjacent the hitting area to detect the passage of a golf club toward the ball. The signals generated by the optical sensor array are employed by the image processing and storage unit to both calculate the club speed and control triggering of the flash unit.
    Type: Grant
    Filed: March 25, 1993
    Date of Patent: August 30, 1994
    Assignee: Timecap, Inc.
    Inventors: Philip L. Chang, Gary S. Flood, Kent W. Kirkes, Edwin R. Smith
  • Patent number: 5032463
    Abstract: Biaxially stretched monolayer and multilayer films comprising blends of a 1-butene very low density polyethylene with a 1-hexene very low density polyethylene have improved combinations of properties including good puncture resistance and shrinkage values and unexpectedly good machine direction shrink force.
    Type: Grant
    Filed: June 7, 1989
    Date of Patent: July 16, 1991
    Assignee: Viskase Corporation
    Inventor: Edwin R. Smith
  • Patent number: 4195195
    Abstract: There is disclosed a universal electrical conductor pattern for both multilayer and single layer test substrates for tape bonded hybrids which is adapted to accept semiconductor chips of various sizes and numbers of leads. The pattern consists of four sets of equally spaced parallel rectangularly shaped outer lead bonding pads which are orthogonally arranged in a repetitive sequence around a chip bonding pad. Each set of outer lead bonding pads consists of a first subset of six like pads arranged adjacently in registration along one edge of the chip bonding pad, and second and third subsets of two outer lead bonding pads each arranged on either side of said first subset in parallel relationship therewith but set back from the corners of the chip bonding pad. The rectangularly shaped outer lead bonding pads extend away from the respective edges of the chip bonding pad a predetermined distance so as to accommodate either twenty four, thirty two or forty pin lead frames having a standard twenty mil lead spacing.
    Type: Grant
    Filed: September 28, 1978
    Date of Patent: March 25, 1980
    Assignee: The United States of America as represented by the Secretary of the Army
    Inventors: William R. R. de Miranda, Edwin R. Smith