Patents by Inventor Edwin Scott Hicklen

Edwin Scott Hicklen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7235201
    Abstract: A device to compact parts out of powder material including a top die and a bottom die movable with respect to each other from an open position to a closed position, at least one punch associated with each of said dies for relative movement between the die and associated punch, said bottom die and bottom punch movable to positions defining a cavity substantially within said top die for receiving powder therein, said bottom punch and said top and bottom dies being relatively movable to draw powder down into a portion of said cavity adjacent the bottom die that is formed due to said relative movement, said top and bottom punches being movable toward each other to compact the powder and form the part, said top and bottom dies being separable to eject the part. Relative movement of the top and bottom die and bottom punch may take place during filling of the cavity with powder.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: June 26, 2007
    Assignee: BorgWarner Inc.
    Inventors: Edwin Scott Hicklen, Sean Kuplen, Kai Xu, Ryan Sun