Patents by Inventor Edwin Thys

Edwin Thys has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE TAPE OR SHEET
    Publication number: 20140154450
    Abstract: A polyvinyl chloride-based adhesive tape or sheet has a base material layer formed to include 10 to 40 parts by weight of plasticizing agent(s) in relation to 100 parts by weight of a polyvinyl chloride-based resin and an adhesive layer on one surface of the base material layer, the plasticizing agent includes at least one type of plasticizing agent having an SP value of at least 9.0.
    Type: Application
    Filed: March 2, 2012
    Publication date: June 5, 2014
    Applicants: NITTO EUROPE N.V., NITTO DENKO CORPORATION
    Inventors: Takumi Yutou, Fumiteru Asai, Toshio Shintani, Toshitaka Suzuki, Minoru Hanaoka, Edwin Thys, Bart Forier
  • Water-permeable adhesive tape
    Patent number: 7608328
    Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.
    Type: Grant
    Filed: January 8, 2007
    Date of Patent: October 27, 2009
    Assignees: Nitto Denko Corporation, Nitto Europe N.V.
    Inventors: Walter Eevers, Ann Issaris, Yoshiaki Mitsuoka, Edwin Thys, Yuuzou Akada
  • Water-permeable adhesive tape
    Publication number: 20070110955
    Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.
    Type: Application
    Filed: January 8, 2007
    Publication date: May 17, 2007
    Inventors: Walter Eevers, Ann Issaris, Yoshiaki Mitsuoka, Edwin Thys, Yuuzou Akada
  • Water-permeable adhesive tape
    Publication number: 20010055928
    Abstract: The present invention relates to a water-permeable adhesive tape for processing semiconductor wafers and/or semiconductor related materials comprising at least one base film and an adhesive, wherein said at least one base film possesses perforations and has a cavity ratio of 3.0 to 90%. The water-permeable adhesive tape is in particular suitable for dicing semiconductor wafers and/or semiconductor related materials using laser technology.
    Type: Application
    Filed: March 28, 2001
    Publication date: December 27, 2001
    Inventors: Walter Eevers, Ann Issaris, Yoshiaki Mitsuoka, Edwin Thys, Yuuzou Akada
  • Click-on spectacles having bifocal lenses
    Patent number: 5880805
    Abstract: The invention relates to a click-up clip-on spectacles comprising a means for clipping the clip-on spectacles to a spectacle frame and bifocal lenses mounted in the clip-on spectacles. The bifocal lenses consist of two parts mounted one above the other and over the entire width of the spectacle glass, the upper part has a dioptre value of 0 and the lower part has a dioptre value of 1 or more. The upper part of each bifocal spectacle lens has a height of about two thirds of the overall height of the lens and the lower part of each bifocal spectacle lens has a height of roughly one third of the overall height of the spectacle lens. The bifocal lenses may be white or coloured.
    Type: Grant
    Filed: January 15, 1997
    Date of Patent: March 9, 1999
    Inventors: Jan Naessens, Edwin Thys