Abstract: Embodiments of the present invention generally relate to an apparatus and methods for rinsing and drying substrates that include multiple rinsing and drying modules. Methods for arranging drying modules to enable high-throughput rinsing and drying of multiple substrates are also provided. In one embodiment a system for drying semiconductor substrates is provided. The system comprises a housing, a first drying module positioned within the housing, and a second drying module positioned adjacent the first drying module within the housing, wherein the first and second drying modules are oriented approximately vertically within the housing.