Abstract: A modular gas pallet assembly is disclosed herein, along with a cleaning unit and chemical mechanical polisher having the same. In one example, the gas pallet assembly includes three outlets and two or less inlets. The gas pallet assembly has first and second primary gas conduits secured to a first mounting plate. The second primary gas conduits is split into two branches, each having their own flow control. The modular gas pallet assembly is configured to provide gas towards a base plate of a substrate cleaner, to substrate gripping pins of the substrate cleaner, and to a bottom of a substrate held by the substrate gripping pins of the substrate cleaner.

Abstract: Embodiments described herein generally relate to equipment used in the manufacturing of electronic devices, and more particularly, to a cleaning system, cleaning system hardware and related methods which may be used to transport and clean the surface of a substrate. According to one embodiment, a blade handling assembly for handling a substrate in a cleaning system includes a gripping assembly including a pair of gripping blades, the blades operable with a gripping actuator to hold a substrate at its edges. The assembly includes a first blade actuator for moving the gripping assembly and substrate between a horizontal and a vertical orientation utilizing a first axis. The assembly includes a second blade actuator for moving the vertically oriented gripping assembly and substrate 180 degrees utilizing a second axis, thereby causing the substrate to face an opposite direction.

Abstract: A method and apparatus for delivering IPA vapor to a substrate processing chamber. In one aspect, the invention includes a controller, a liquid mass flow controller (LMFC) associated with a vaporizer to convert a first fluid to a vapor, a mass flow controller (MFC) associated with the carrier gas, a mixing unit to mix the vapor with the carrier gas to create the predetermined mixture and a drain circuit including a first flow path having a first valve between the mixing unit and a drain, a second flow path having a second valve between the mixing unit and the processing chamber, whereby the first flow path can be opened until the predetermined mixture is reached and thereafter, the second flow path can be opened allowing the predetermined mixture to be delivered to the chamber.

Abstract: A method and apparatus for Marangoni substrate drying is disclosed which includes an adjustable spray bar assembly having mounting brackets coupled to a support structure of a drying system, a base assembly coupled to the mounting brackets and disposed parallel to a face of the support structure, and a mounting assembly coupled to and parallel with the base assembly. The mounting assembly is adjustable in a vertical direction at two distal ends. The mounting assembly includes arms onto which one or more spray bars may be disposed. While secured to the mounting assembly, the one or more spray bars may be rotated about a longitudinal axis.

Abstract: One or more embodiments described herein generally relate to drying environments within semiconductor processing systems. In these embodiments, substrates are cleaned and dried within a drying environment before returning to the factory interface. However, due to an opening between the factory interface and the drying environment, air flows from the factory interface into the drying environment, often reducing the effectiveness of the drying processes. In embodiments described herein, the air flow is blocked by a sliding door that raises up to the closed position when a substrate enters the drying portion of the dryer located within the drying environment. After the substrate exits the dryer and before the substrate enters the factory interface, the sliding door lowers to the opened position such that the substrate can enter the factory interface. As such, these processes allow for multiple substrates to dry quickly and consistently within the system, improving throughput.

Abstract: One or more embodiments described herein generally relate to drying environments within semiconductor processing systems. In these embodiments, substrates are cleaned and dried within a drying environment before returning to the factory interface. However, due to an opening between the factory interface and the drying environment, air flows from the factory interface into the drying environment, often reducing the effectiveness of the drying processes. In embodiments described herein, the air flow is blocked by a sliding door that raises up to the closed position when a substrate enters the drying portion of the dryer located within the drying environment. After the substrate exits the dryer and before the substrate enters the factory interface, the sliding door lowers to the opened position such that the substrate can enter the factory interface. As such, these processes allow for multiple substrates to dry quickly and consistently within the system, improving throughput.

Abstract: One or more embodiments described herein generally relate to drying environments within semiconductor processing systems. In these embodiments, substrates are cleaned and dried within a drying environment before returning to the factory interface. However, due to an opening between the factory interface and the drying environment, air flows from the factory interface into the drying environment, often reducing the effectiveness of the drying processes. In embodiments described herein, the air flow is blocked by a sliding door that raises up to the closed position when a substrate enters the drying portion of the dryer located within the drying environment. After the substrate exits the dryer and before the substrate enters the factory interface, the sliding door lowers to the opened position such that the substrate can enter the factory interface. As such, these processes allow for multiple substrates to dry quickly and consistently within the system, improving throughput.

Abstract: One or more embodiments described herein generally relate to drying environments within semiconductor processing systems. In these embodiments, substrates are cleaned and dried within a drying environment before returning to the factory interface. However, due to an opening between the factory interface and the drying environment, air flows from the factory interface into the drying environment, often reducing the effectiveness of the drying processes. In embodiments described herein, the air flow is blocked by a sliding door that raises up to the closed position when a substrate enters the drying portion of the dryer located within the drying environment. After the substrate exits the dryer and before the substrate enters the factory interface, the sliding door lowers to the opened position such that the substrate can enter the factory interface. As such, these processes allow for multiple substrates to dry quickly and consistently within the system, improving throughput.

Abstract: A method and apparatus for Marangoni substrate drying is disclosed which includes an adjustable spray bar assembly having mounting brackets coupled to a support structure of a drying system, a base assembly coupled to the mounting brackets and disposed parallel to a face of the support structure, and a mounting assembly coupled to and parallel with the base assembly. The mounting assembly is adjustable in a vertical direction at two distal ends. The mounting assembly includes arms onto which one or more spray bars may be disposed. While secured to the mounting assembly, the one or more spray bars may be rotated about a longitudinal axis.

Abstract: Embodiments of the present invention provide systems, apparatus, and methods for an improved substrate handling assembly. Embodiments include a pair of actuated arms; a pair of substrate capture tips, each capture tip formed in a different distal end of each actuated arm; an actuator coupled to a proximate end of the actuated arms and operative to actuate the actuated arms; and a hard stop positioned to prevent the actuator from closing the actuated arms more than a predefined amount so that in a closed position, the actuated arms do not contact a substrate positioned to be picked up by the substrate handing assembly. Numerous additional aspects are disclosed.

Abstract: In one or more embodiments, a substrate holder apparatus is provided. A substrate holder apparatus includes a frame having multiple substrate contact supports configured to contact and support a substrate, and one or more vacuum ports configured to apply a vacuum at one or more locations along a bottom edge of a substrate. The one or more vacuum ports provide air outflow that removes liquid and/or residue along a bottom edge of the substrate after immersion into a tank. Assemblies including the substrate holder apparatus and methods of cleaning substrates with the substrate holder apparatus are provided, as are additional aspects.

Abstract: In one or more embodiments, a substrate edge residue removal apparatus is provided. A substrate edge residue removal apparatus includes a lower body including a gas cavity; and an upper plate removably coupled to the lower body, wherein the lower body and upper plate together form an assembly having a passageway leading from the gas cavity to a plenum and an output slit extending along a length of the plenum and in fluid communication with the plenum. Assemblies including the substrate edge residue removal apparatus and methods of cleaning substrates with the substrate edge residue removal apparatus are provided, as are numerous additional aspects.

Abstract: A substrate gripper apparatus is provided. Substrate gripper apparatus includes a body, a first slide member moveable relative to the body, a first finger mounting member coupled to the first slide member, a first lower finger coupled to the first finger mounting member, and a first pivoting finger coupled to the first finger mounting member. First pivoting member may impose a force on a substrate due to gravity. Methods of operating the substrate gripper apparatus as well as other aspects are provided.

Abstract: The present invention provides methods and apparatus for a Marangoni vapor knife assembly. The assembly includes a base having a channel extending longitudinally through the base and a plurality of passages extending laterally from the channel toward an outer face of the base; a top plate adapted to be removeably coupled to the base with an outer face flush with the outer face of the base; and a shim adapted to be disposed between the base and the top plate and further adapted to form a plurality of spray orifices in the assembly. Numerous additional features are disclosed.

Abstract: The present invention provides methods and apparatus for a Marangoni vapor knife assembly. The assembly includes a base having a channel extending longitudinally through the base and a plurality of passages extending laterally from the channel toward an outer face of the base; a top plate adapted to be removeably coupled to the base with an outer face flush with the outer face of the base; and a shim adapted to be disposed between the base and the top plate and further adapted to form a plurality of spray orifices in the assembly. Numerous additional features are disclosed.