Abstract: Allowing a calling party to enter a message that is transmitted on a destination telephone link during silent intervals of a ringing signal by a switching office. In a first embodiment, the destination telephone link is equipped with the feature of allowing receipt of calling party specified data messages. The switching office automatically accepts information for a data message as dialed digits from the calling party. In a second embodiment, the switching office designates that an originating telephone link can transmit information for a data message. The switching office is responsive to the transmitted information to form a data message and to transmit this data message on a destination telephone link during the silent intervals of the ringing cycles. In a third embodiment, in response to a calling party placing a call to a special telephone number, the switching office requests that the calling party enter a destination telephone number and information for a data message.

Abstract: A testing system for stressing assembled circuit boards well beyond normal operational limits with respect to mechanical vibration, supply voltage cycling, and temperature cycling. The combination of these three elements of stressing results in each of the three elements accelerating the effects of the other two elements. The circuit boards are transferred between a cold bath of inert liquid and a hot bath of inert liquid while power voltages are applied for short periods of time at voltages which exceed the normal voltages of the devices and vibrations are introduced into the inert liquid. The vibrations scan a broad range of frequencies thus accelerating the effect of the hot bath. In particular, in the hot bath, the use of ultrasonic frequency greatly accelerates the speed at which components are induced to absorb heat. The vibrations allow the detection of potential failures in the wire bonding of integrated circuits.

Abstract: A method that stress assembled circuit boards well beyond normal operational limits both with respect to supply voltages and temperature cycling. The circuit boards are transferred between a cold bath of inert liquid and a hot bath of inert liquid while the power voltages are being applied for short periods of time at voltages which exceed the nominal voltages of the devices. The circuit boards are transferred from the hot bath to the cold bath or vice versa in less than 30 seconds, and maximum stresses are achieved without damaging parts or the circuit boards.