Patents by Inventor Edy Sung

Edy Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power supply structure for high density servers
    Patent number: 6754087
    Abstract: A power supply structure for high density servers bridging a system end and a power supply end includes a power receiving unit located on the system end, a power transmission unit located on the power supply end, and a conductive connection element connecting the power receiving unit and the power transmission unit through fasteners. The conductive connection element establishes electric connection with the power receiving unit and the power transmission unit through the fasteners so that power supply provided by the power supply end is transmitted from the power transmission unit to the conductive connection element which in turn transmits the power to the system end through the power receiving unit. The power supply structure of the invention may be assembled and installed quickly.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: June 22, 2004
    Assignee: Shin Jiuh Corp.
    Inventors: Tzung-Han Lee, Edy Sung