Abstract: A method for forming and releasing interconnects by using a dummy substrate. The method comprises applying metallization to the dummy substrate for creating a relatively strong bond between the metallization and the dummy substrate and a weak bond between a first end of each of the interconnects and the metallization; weakly bonding the first ends to the metallization; shaping the interconnects; releasing the weak bond between the metallization and the first ends by using a reduced release force to release the first end of the interconnects from the dummy substrate.

Abstract: A method for forming interconnects between a component and a substrate. The method comprises determining at least one location of differential flexing between a component and a substrate during drop impact; and forming a plurality of solder joints on at least one of the component and the substrate. A first number of the plurality of solder joints has a reduced amount of solder and a second number of the plurality of solder joints has normal solder content. The method also comprises conducting solder reflow of the plurality of solder joints to form interconnects between the component and the substrate. Those interconnects formed by the first number of solder joints have a reduced amount of solder forming an included angle with at least one of the component and the substrate. The included angle is large compared to an included angle between each of: the component and the substrate, and the second number of solder joints of normal solder content.

Abstract: A micro-impact testing apparatus for measuring the impact characteristics of a microelectronics specimen exposed to an impact thereon. The apparatus comprises of a specimen holder for receiving a specimen to be tested, and an impact device. The impact device comprises of an impact head, a support member, at least one connecting element and a first flexural spring. The support member is connected to the connecting element in that the first flexural spring is firmly attached with its one end to the support member and with its other end to the connecting element. A second flexural spring, being at least substantially identical to said first flexural spring, is firmly attached with its one end to the connecting element and with its other end to the impact head so that the ends of the first and second flexural springs define, in an unloaded state of the flexural springs, a rectangle.

Abstract: A bend testing apparatus for simulating free vibrational flexing at high speeds and frequencies in a test specimen, said apparatus comprising a cam having a narrow circumferential profile or linear profile wherein at least one portion of the profile of said cam comprises at least one waveform, a specimen holder that holds the test specimen on opposite ends of the test specimen in a default position, a light-weight deformation member operable to deflect at least one point on the test specimen from the default position, a follower with one end in operable contact with the cam and its other end connected to the deformation member, such that a displacement of the follower is according to the profile of the cam, to actuate the deformation member correspondingly and to deflect the at least one point on the test specimen from said default position upon movement of the cam.

Abstract: A micro-impact testing apparatus for measuring the impact characteristics of a microelectronics specimen exposed to an impact thereon. The apparatus comprises of a specimen holder for receiving a specimen to be tested, and an impact device. The impact device comprises of an impact head, a support member, at least one connecting element and a first flexural spring. The support member is connected to the connecting element in that the first flexural spring is firmly attached with its one end to the support member and with its other end to the connecting element. A second flexural spring, being at least substantially identical to said first flexural spring, is firmly attached with its one end to the connecting element and with its other end to the impact head so that the ends of the first and second flexural springs define, in an unloaded state of the flexural springs, a rectangle.

Abstract: A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.

Abstract: We disclose a technique to generate stretched solder columns (bumps) at the wafer level, suitable for wafer level packaging. This is accomplished through use of using two wafers—the standard (functional) wafer that contains the integrated circuits and a master (dummy) wafer on whose surface is provided an array of solder bumps that is the mirror image of that on the functional wafer. After suitable alignment, both sets of solder bumps are melted and then slowly brought together till they merge. Then, as they cool, they are slowly pulled apart thereby stretching the merged solder columns. Once the latter have fully solidified, they are separated from the master wafer only.