Abstract: In an embodiment an optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a radiation exit surface and side surfaces running transversely with respect to the radiation exit surface, the optoelectronic semiconductor chip configured to emit primary radiation through the radiation exit surface, a conversion element arranged on the radiation exit surface, the conversion element configured to convert at least part of the primary radiation into secondary radiation and including a stack of at least two conversion layers and a reflective element laterally surrounding the optoelectronic semiconductor chip, wherein a lateral extent of the conversion layers decreases from a layer which is closest to the radiation exit surface to a layer which is most distant from the radiation exit surface, wherein the conversion element includes a part laterally extending beyond the radiation exit surface and being concavely curved, wherein the conversion element is partly arranged on the reflectiv

Abstract: In an embodiment a method for producing a plurality of radiation-emitting devices includes providing a plurality of semiconductor chips on a main surface of a carrier, each semiconductor chip for emitting electromagnetic radiation from a radiation exit surface, arranging a lens mold with a plurality of cavities over the carrier, introducing a liquid mold material into the cavities of the lens mold and curing the liquid mold material such that a plurality of molded lenses is generated, wherein the molded lenses directly adjoin the main surface of the carrier, wherein regions of an outer surface of the molded lenses directly adjacent to the main surface of the carrier are free of planar areas, and wherein the carrier includes a plurality of carrier elements, the carrier elements having a first recess in a main surface extending from a side face of the carrier element.

Abstract: An LED filament is disclosed.

Abstract: An LED Filament is disclosed.

Abstract: In an embodiment the optical component includes an optoelectronic semiconductor chip including a radiation emission face, a deflection element configured to deflect electromagnetic radiation emitted by the optoelectronic semiconductor chip in a main emission direction which forms an angle deviating from 90° with the radiation emission face, wherein the deflection element is configured as a prism structure and an optical lens having an optical axis, wherein the optical axis forms an angle deviating from 90° with the radiation emission face.

Abstract: An optoelectronic component is disclosed. In an embodiment the optical component includes an optoelectronic semiconductor chip including a radiation emission face, a deflection element configured to deflect electromagnetic radiation emitted by the optoelectronic semiconductor chip in a main emission direction which forms an angle deviating from 90° with the radiation emission face, wherein the deflection element is configured as a prism structure and an optical lens having an optical axis, wherein the optical axis forms an angle deviating from 90° with the radiation emission face.

Abstract: The invention relates to a structural component which comprises a support (1), an optoelectronic semiconductor chip (2) having at least one lateral face (2a), further comprising a connecting means (3), a first molded element (4), and a second molded element (5), the optoelectronic semiconductor chip (2) being mechanically connected to the support (1) by the connecting means (3). The first molded element (4) covers an exposed outer face of the optoelectronic semiconductor chip (2) and the first molded element (4) covers an exposed outer face of the connecting means (3). The second molded element (5) covers an exposed outer face of the first molded element (5) and the second molded element (5) has a higher modulus of elasticity at room temperature than the first molded element.

Abstract: The invention relates to a structural component which comprises a support (1), an optoelectronic semiconductor chip (2) having at least one lateral face (2a), further comprising a connecting means (3), a first molded element (4), and a second molded element (5), the optoelectronic semiconductor chip (2) being mechanically connected to the support (1) by the connecting means (3). The first molded element (4) covers an exposed outer face of the optoelectronic semiconductor chip (2) and the first molded element (4) covers an exposed outer face of the connecting means (3). The second molded element (5) covers an exposed outer face of the first molded element (5) and the second molded element (5) has a higher modulus of elasticity at room temperature than the first molded element.