Patents by Inventor EE-SUN LIM

EE-SUN LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Producing apparatus
    Patent number: 11784158
    Abstract: A producing apparatus and a pre-bonding device are provided. The pre-bonding device includes a dispensing mechanism and a die-placing mechanism that is arranged adjacent to the dispensing mechanism. The dispensing mechanism is configured to form a plurality of adhesives onto a plurality of carriers, respectively. The die-placing mechanism includes a plurality of catchers configured to respectively hold a plurality of chips and a correction unit that is configured to adjust a relative position of the chips. The catchers are configured to synchronously place the chips adjusted by the correction unit onto the adhesives, respectively.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: October 10, 2023
    Assignee: GALLANT MICRO. MACHINING CO., LTD.
    Inventors: Tun-Chih Shih, Liang-Yin Huang, Ee-Sun Lim
  • PRODUCING APPARATUS AND PRE-BONDING DEVICE
    Publication number: 20220122939
    Abstract: A producing apparatus and a pre-bonding device are provided. The pre-bonding device includes a dispensing mechanism and a die-placing mechanism that is arranged adjacent to the dispensing mechanism. The dispensing mechanism is configured to form a plurality of adhesives onto a plurality of carriers, respectively. The die-placing mechanism includes a plurality of catchers configured to respectively hold a plurality of chips and a correction unit that is configured to adjust a relative position of the chips. The catchers are configured to synchronously place the chips adjusted by the correction unit onto the adhesives, respectively.
    Type: Application
    Filed: March 23, 2021
    Publication date: April 21, 2022
    Inventors: TUN-CHIH SHIH, LIANG-YIN HUANG, EE-SUN LIM