Patents by Inventor Ee Teoh Lim

Ee Teoh Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11004820
    Abstract: An apparatus and method for filling a ball grid array template and a method for transferring a plurality of balls are disclosed. The apparatus includes a flat base, a plate and a stationary ball supply bin. The plate is mounted on the base and configured to be rotatable about a first axis perpendicular to the base. An upper surface of the plate includes a plurality of holes forming the ball grid array template. The stationary ball supply bin is mounted to the base. The base is configured to be inclined at an angle relative to a horizontal plane. The ball supply bin is configured in use to dispense a plurality of balls onto the corresponding plurality of holes forming the ball grid array template as the plate is rotated about the first axis.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: May 11, 2021
    Assignee: Aurigin Technology Pte Ltd
    Inventors: Boon Chew Ng, Ee Teoh Lim
  • Publication number: 20200194400
    Abstract: An apparatus and method for filling a ball grid array template and a method for transferring a plurality of balls are disclosed. The apparatus includes a flat base, a plate and a stationary ball supply bin. The plate is mounted on the base and configured to be rotatable about a first axis perpendicular to the base. An upper surface of the plate includes a plurality of holes forming the ball grid array template. The stationary ball supply bin is mounted to the base. The base is configured to be inclined at an angle relative to a horizontal plane. The ball supply bin is configured in use to dispense a plurality of balls onto the corresponding plurality of holes forming the ball grid array template as the plate is rotated about the first axis.
    Type: Application
    Filed: February 27, 2018
    Publication date: June 18, 2020
    Applicant: Aurigin Technology Pte Ltd
    Inventors: Boon Chew Ng, Ee Teoh Lim
  • Patent number: 8146793
    Abstract: A pin for allowing material having adhesive properties to adhere thereon, the pin comprising: a shaft having a longitudinal axis, a distal end and a proximal end opposite to the distal end; and a first tapered portion disposed on the longitudinal axis of the shaft, the tapered portion tapering from a first circumference to a second smaller circumference in a direction toward the proximal end of the shaft.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: April 3, 2012
    Assignee: Aurigin Technology Pte. Ltd.
    Inventors: Boon Chew Ng, Thian Seng Loo, Ee Teoh Lim
  • Publication number: 20090035531
    Abstract: A pin for allowing material having adhesive properties to adhere thereon, the pin comprising: a shaft having a longitudinal axis, a distal end and a proximal end opposite to the distal end; and a first tapered portion disposed on the longitudinal axis of the shaft, the tapered portion tapering from a first circumference to a second smaller circumference in a direction toward the proximal end of the shaft.
    Type: Application
    Filed: April 19, 2005
    Publication date: February 5, 2009
    Applicant: AURIGIN TECHNOLOGY PTE LTD
    Inventors: Boon Chew Ng, Thian Seng Loo, Ee Teoh Lim
  • Patent number: 7458499
    Abstract: An apparatus and method for filling a ball grid array template is disclosed. The apparatus comprises a normally horizontal base plate with the ball grid array template being mounted onto the base plate at one end. A solder ball supply bin is slidably mounted over the surface of the base plate. The bin is enclosed on three vertical sides, while the fourth vertical side proximate the ball grid array template is a pivotable ball gate. At rest, the bin is located at an end of the base plate opposite to the template. When the base is tilted, the bin slides from its rest location to the other end of the base plate, so that it is positioned over the template, thereby allowing the solder balls to fill the locating holes of the template. The base is then rotated so that it tilts the opposite way, allowing the bin to return to its rest position. As the bin returns to its rest position, the ball gate sweeps any excess balls on the surface of the template back into the bin.
    Type: Grant
    Filed: October 13, 2003
    Date of Patent: December 2, 2008
    Assignee: Aurigin Technology PTE Ltd.
    Inventors: Boon Chew Ng, Wing Wah Tam, Ee Teoh Lim