Abstract: A color tag comprises a substrate having a visually detectable tint associated with a portion thereof and a code which reflects color information relating to individual color parameters of said visually detectable tint, as well as identity information that specifically identifies said color tag itself.

Abstract: A bend testing apparatus for simulating free vibrational flexing at high speeds and frequencies in a test specimen, said apparatus comprising a cam having a narrow circumferential profile or linear profile wherein at least one portion of the profile of said cam comprises at least one waveform, a specimen holder that holds the test specimen on opposite ends of the test specimen in a default position, a light-weight deformation member operable to deflect at least one point on the test specimen from the default position, a follower with one end in operable contact with the cam and its other end connected to the deformation member, such that a displacement of the follower is according to the profile of the cam, to actuate the deformation member correspondingly and to deflect the at least one point on the test specimen from said default position upon movement of the cam.

Abstract: A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.

Abstract: A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.