Patents by Inventor Eef Boschman

Eef Boschman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for die and clip attachment
    Patent number: 11289447
    Abstract: A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, and sintering the substrate, die and clip package.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: March 29, 2022
    Assignees: Alpha Assembly Solutions, Inc., Advanced Packaging Center BV
    Inventors: Oscar Khaselev, Eef Boschman
  • Method for Die and Clip Attachment
    Publication number: 20180166415
    Abstract: A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, lead and sintering the substrate, die and clip package.
    Type: Application
    Filed: December 16, 2015
    Publication date: June 14, 2018
    Inventors: Oscar Khaselev, Eef Boschman