Patents by Inventor Eehern J. Wong
Eehern J. Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10785896Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.Type: GrantFiled: June 26, 2019Date of Patent: September 22, 2020Assignee: Google LLCInventors: Eehern J. Wong, Pascal Kam, Thomas R. Kowalski, Ron Drew
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Patent number: 10542641Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: GrantFiled: April 10, 2018Date of Patent: January 21, 2020Assignee: Google LLCInventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Publication number: 20190320558Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.Type: ApplicationFiled: June 26, 2019Publication date: October 17, 2019Inventors: Eehern J. Wong, Pascal Kam, Thomas R. Kowalski, Ron Drew
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Patent number: 10342163Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.Type: GrantFiled: December 2, 2015Date of Patent: July 2, 2019Assignee: Google LLCInventors: Eehern J. Wong, Pascal Kam, Thomas R. Kowalski, Ron Drew
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Publication number: 20180235108Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: ApplicationFiled: April 10, 2018Publication date: August 16, 2018Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Patent number: 9961803Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: GrantFiled: November 22, 2016Date of Patent: May 1, 2018Assignee: Google LLCInventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Publication number: 20170164522Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.Type: ApplicationFiled: December 2, 2015Publication date: June 8, 2017Inventors: Eehern J. Wong, Pascal Kam, Thomas R. Kowalski, Ron Drew
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Publication number: 20170079167Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: ApplicationFiled: November 22, 2016Publication date: March 16, 2017Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Patent number: 9554491Abstract: A data center cooling system includes a cooling liquid supply conduit fluidly coupled between a cooling plant and an air-to-liquid heat exchanger positioned to receive a heated airflow from one or more racks. At least one rack supports a plurality of heat-generating electronic devices. The system further includes a cooling liquid return conduit fluidly coupled between the cooling plant and the air-to-liquid heat exchanger; and a heat transfer module thermally coupled to the cooling liquid supply and return conduits between the cooling plant and the air-to-liquid heat exchanger. The heat transfer module includes a cold side and a warm side, with the cold side thermally coupled to the cooling liquid supply conduit to transfer heat from a flow of a cooling liquid in the cooling liquid supply conduit to the warm side of the heat transfer module, and the warm side including a heat sink.Type: GrantFiled: July 1, 2014Date of Patent: January 24, 2017Assignee: Google Inc.Inventors: Eehern J. Wong, Gregory P. Imwalle, Emad Samadiani
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Patent number: 9552025Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: GrantFiled: September 23, 2014Date of Patent: January 24, 2017Assignee: Google Inc.Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Patent number: 9398731Abstract: A cooling apparatus for rack-mounted computing devices includes a heat sink including a thermal interface to conductively contact a computing device mounted on a printed circuit board; a cold plate including a first portion in thermal communication with the heat sink with a working fluid, and a second portion that includes a cooling coil in thermal communication with the first portion, the cooling coil including an inlet to receive chilled liquid; a fan positioned to circulate airflow over the cold plate; and a controller coupled to the fan to adjust a speed of the fan in response to an output of a sensor coupled to the computing device.Type: GrantFiled: September 23, 2014Date of Patent: July 19, 2016Assignee: Google Inc.Inventors: Gregory P. Imwalle, Eehern J. Wong, Emad Samadiani, Soheil Farshchian
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Publication number: 20160085277Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.Type: ApplicationFiled: September 23, 2014Publication date: March 24, 2016Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
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Publication number: 20140014292Abstract: A data center cooling system includes a plurality of cooling units positioned adjacent a warm air plenum that is in airflow communication with a plurality of electronic devices supported in a plurality of racks. Each of the cooling units includes a heat exchanger arranged to cool warmed air circulated into the warm air plenum from a human-occupiable workspace adjacent the plurality of racks opposite the plurality of cooling units, and a fan arranged to circulate the warmed air from the warm air plenum through the heat exchanger and to the human-occupiable workspace. The cooling system includes a control system electrically coupled to the fan and configured to modulate a fan speed of the fan of each cooling unit to induce a pressure gradient in the warm air plenum.Type: ApplicationFiled: July 16, 2012Publication date: January 16, 2014Applicant: GOOGLE INC.Inventors: Jeremy Rice, Pascal Kam, Gregory P. Imwalle, Eehern J. Wong