Patents by Inventor Eehern J. Wong

Eehern J. Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10785896
    Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: September 22, 2020
    Assignee: Google LLC
    Inventors: Eehern J. Wong, Pascal Kam, Thomas R. Kowalski, Ron Drew
  • Patent number: 10542641
    Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: January 21, 2020
    Assignee: Google LLC
    Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
  • Publication number: 20190320558
    Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.
    Type: Application
    Filed: June 26, 2019
    Publication date: October 17, 2019
    Inventors: Eehern J. Wong, Pascal Kam, Thomas R. Kowalski, Ron Drew
  • Patent number: 10342163
    Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: July 2, 2019
    Assignee: Google LLC
    Inventors: Eehern J. Wong, Pascal Kam, Thomas R. Kowalski, Ron Drew
  • Publication number: 20180235108
    Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
    Type: Application
    Filed: April 10, 2018
    Publication date: August 16, 2018
    Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
  • Patent number: 9961803
    Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: May 1, 2018
    Assignee: Google LLC
    Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
  • Publication number: 20170164522
    Abstract: A data center cooling system includes a plurality of server racks aligned within a row in a human-occupiable workspace of a data center, the server racks supporting a plurality of heat-generating computing devices; a warm air aisle positioned adjacent the server racks opposite the human-occupiable workspace and including a warm air inlet adjacent to a back side of the row of server racks and a warm air outlet in fluid communication with a warm air plenum; a plurality of cooling modules each including at least one fan and a cooling coil; and a controller to perform operations including controlling the plurality of fans in the plurality of cooling modules to operate at a specified fan speed, and controlling a plurality of valves fluidly coupled to the plurality of cooling coils in the plurality of cooling modules to modulate to a specified valve position.
    Type: Application
    Filed: December 2, 2015
    Publication date: June 8, 2017
    Inventors: Eehern J. Wong, Pascal Kam, Thomas R. Kowalski, Ron Drew
  • Publication number: 20170079167
    Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
    Type: Application
    Filed: November 22, 2016
    Publication date: March 16, 2017
    Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
  • Patent number: 9554491
    Abstract: A data center cooling system includes a cooling liquid supply conduit fluidly coupled between a cooling plant and an air-to-liquid heat exchanger positioned to receive a heated airflow from one or more racks. At least one rack supports a plurality of heat-generating electronic devices. The system further includes a cooling liquid return conduit fluidly coupled between the cooling plant and the air-to-liquid heat exchanger; and a heat transfer module thermally coupled to the cooling liquid supply and return conduits between the cooling plant and the air-to-liquid heat exchanger. The heat transfer module includes a cold side and a warm side, with the cold side thermally coupled to the cooling liquid supply conduit to transfer heat from a flow of a cooling liquid in the cooling liquid supply conduit to the warm side of the heat transfer module, and the warm side including a heat sink.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: January 24, 2017
    Assignee: Google Inc.
    Inventors: Eehern J. Wong, Gregory P. Imwalle, Emad Samadiani
  • Patent number: 9552025
    Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: January 24, 2017
    Assignee: Google Inc.
    Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
  • Patent number: 9398731
    Abstract: A cooling apparatus for rack-mounted computing devices includes a heat sink including a thermal interface to conductively contact a computing device mounted on a printed circuit board; a cold plate including a first portion in thermal communication with the heat sink with a working fluid, and a second portion that includes a cooling coil in thermal communication with the first portion, the cooling coil including an inlet to receive chilled liquid; a fan positioned to circulate airflow over the cold plate; and a controller coupled to the fan to adjust a speed of the fan in response to an output of a sensor coupled to the computing device.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: July 19, 2016
    Assignee: Google Inc.
    Inventors: Gregory P. Imwalle, Eehern J. Wong, Emad Samadiani, Soheil Farshchian
  • Publication number: 20160085277
    Abstract: A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
    Type: Application
    Filed: September 23, 2014
    Publication date: March 24, 2016
    Inventors: Emad Samadiani, Eehern J. Wong, Gregory P. Imwalle, Soheil Farshchian
  • Publication number: 20140014292
    Abstract: A data center cooling system includes a plurality of cooling units positioned adjacent a warm air plenum that is in airflow communication with a plurality of electronic devices supported in a plurality of racks. Each of the cooling units includes a heat exchanger arranged to cool warmed air circulated into the warm air plenum from a human-occupiable workspace adjacent the plurality of racks opposite the plurality of cooling units, and a fan arranged to circulate the warmed air from the warm air plenum through the heat exchanger and to the human-occupiable workspace. The cooling system includes a control system electrically coupled to the fan and configured to modulate a fan speed of the fan of each cooling unit to induce a pressure gradient in the warm air plenum.
    Type: Application
    Filed: July 16, 2012
    Publication date: January 16, 2014
    Applicant: GOOGLE INC.
    Inventors: Jeremy Rice, Pascal Kam, Gregory P. Imwalle, Eehern J. Wong