Patents by Inventor Eelco VAN SETTEN

Eelco VAN SETTEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11815808
    Abstract: A method for source mask optimization with a lithographic projection apparatus. The method includes determining a multi-variable source mask optimization function using a plurality of tunable design variables for an illumination system of the lithographic projection apparatus, a projection optics of the lithographic projection apparatus to image a mask design layout onto a substrate, and the mask design layout. The multi-variable source mask optimization function may account for imaging variation across different positions in an exposure slit corresponding to different stripes of the mask design layout exposed by a same slit position of the exposure apparatus. The method includes iteratively adjusting the plurality of tunable design variables in the multi-variable source mask optimization function until a termination condition is satisfied.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: November 14, 2023
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Kars Zeger Troost, Eelco Van Setten, Duan-Fu Stephen Hsu
  • Patent number: 11314174
    Abstract: Disclosed is a method of measuring focus performance of a lithographic apparatus, and corresponding patterning device and lithographic apparatus. The method comprises using the lithographic apparatus to print one or more first printed structures and second printed structures. The first printed structures are printed by illumination having a first non-telecentricity and the second printed structures being printed by illumination having a second non-telecentricity, different to said first non-telecentricity. A focus dependent parameter related to a focus-dependent positional shift between the first printed structures and the second printed structures on said substrate is measured and a measurement of focus performance based at least in part on the focus dependent parameter is derived therefrom.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: April 26, 2022
    Assignee: ASML Netherlands B.V.
    Inventors: Laurentius Cornelius De Winter, Roland Pieter Stolk, Frank Staals, Anton Bernhard Van Oosten, Paul Christiaan Hinnen, Marinus Jochemsen, Thomas Theeuwes, Eelco Van Setten
  • Publication number: 20220050373
    Abstract: A method for source mask optimization with a lithographic projection apparatus. The method includes determining a multi-variable source mask optimization function using a plurality of tunable design variables for an illumination system of the lithographic projection apparatus, a projection optics of the lithographic projection apparatus to image a mask design layout onto a substrate, and the mask design layout. The multi-variable source mask optimization function may account for imaging variation across different positions in an exposure slit corresponding to different stripes of the mask design layout exposed by a same slit position of the exposure apparatus. The method includes iteratively adjusting the plurality of tunable design variables in the multi-variable source mask optimization function until a termination condition is satisfied.
    Type: Application
    Filed: October 3, 2019
    Publication date: February 17, 2022
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Kars Zeger TROOST, Eelco VAN SETTEN, Duan-Fu Stephen HSU
  • Patent number: 10928735
    Abstract: A patterning device for use with a lithographic apparatus, the device comprising an absorber portion configured to absorb incident radiation and to reflect a portion of incident radiation, the absorber portion comprising a first layer and a second layer, the first layer of the absorber portion comprising a first material that is different from a second material of the second layer of the absorber portion; a reflector portion arranged beneath the absorber portion, the reflector portion being configured to reflect incident radiation; and a phase tune portion arranged between the reflector portion and the absorber portion, the phase tune portion being configured to induce a phase shift between the radiation reflected by the reflector portion and the portion of radiation reflected by the absorber portion such that the radiation reflected by the reflector portion destructively interferes with the portion of radiation reflected by the absorber portion.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: February 23, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Marcus Adrianus Van De Kerkhof, Laurentius Cornelius De Winter, Eelco Van Setten
  • Publication number: 20200264522
    Abstract: Disclosed is a method of measuring focus performance of a lithographic apparatus, and corresponding patterning device and lithographic apparatus. The method comprises using the lithographic apparatus to print one or more first printed structures and second printed structures. The first printed structures are printed by illumination having a first non-telecentricity and the second printed structures being printed by illumination having a second non-telecentricity, different to said first non-telecentricity. A focus dependent parameter related to a focus-dependent positional shift between the first printed structures and the second printed structures on said substrate is measured and a measurement of focus performance based at least in part on the focus dependent parameter is derived therefrom.
    Type: Application
    Filed: August 3, 2018
    Publication date: August 20, 2020
    Applicant: ASML Netherlands B.V.
    Inventors: Laurentius Cornelius DE WINTER, Roland Pieter STOLK, Frank STAALS, Anton Bernhard VAN OOSTEN, Paul Christiaan HINNEN, Marinus JOCHEMSEN, Thomas THEEUWES, Eelco VAN SETTEN
  • Publication number: 20200096875
    Abstract: A patterning device for use with a lithographic apparatus, the device comprising an absorber portion configured to absorb incident radiation and to reflect a portion of incident radiation, the absorber portion comprising a first layer and a second layer, the first layer of the absorber portion comprising a first material that is different from a second material of the second layer of the absorber portion; a reflector portion arranged beneath the absorber portion, the reflector portion being configured to reflect incident radiation; and a phase tune portion arranged between the reflector portion and the absorber portion, the phase tune portion being configured to induce a phase shift between the radiation reflected by the reflector portion and the portion of radiation reflected by the absorber portion such that the radiation reflected by the reflector portion destructively interferes with the portion of radiation reflected by the absorber portion.
    Type: Application
    Filed: November 27, 2019
    Publication date: March 26, 2020
    Inventors: Marcus Adrianus VAN DE KERKHOF, Laurentius Cornelius DEWINTER, Eelco VAN SETTEN
  • Patent number: 9798225
    Abstract: A method of characterizing a lithographic mask type uses a mask having thereon test pattern units of linear features at different orientations. The mask is exposed, rotated by angle, exposed again, rotated by a further angle, exposed, etc. The printed features are measured to determine one or more characteristics of the mask. The method can be used to model shadowing effects of a EUV mask with a thick absorber illuminated at an angle.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: October 24, 2017
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Eelco Van Setten, Natalia Viktorovna Davydova, Eleni Psara, Anton Bernhard Van Oosten
  • Publication number: 20160266483
    Abstract: A method of characterizing a lithographic mask type uses a mask having thereon test pattern units of linear features at different orientations. The mask is exposed, rotated by angle, exposed again, rotated by a further angle, exposed, etc. The printed features are measured to determine one or more characteristics of the mask. The method can be used to model shadowing effects of a EUV mask with a thick absorber illuminated at an angle.
    Type: Application
    Filed: October 14, 2014
    Publication date: September 15, 2016
    Applicant: ASML Netherlands B.V.
    Inventors: Eelco VAN SETTEN, Natalia Viktorovna DAVYDOVA, Eleni PSARA, Anton Bernhard VAN OOSTEN