Patents by Inventor Eerik Halonen

Eerik Halonen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna
    Patent number: 11244220
    Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: February 8, 2022
    Assignee: Digital Tags Finland, OY
    Inventors: Lauri Huhtasalo, Eerik Halonen, Juha Ikonen
  • METHOD FOR MANUFACTURING AN RFID TAG AND AN RFID TAG COMPRISING AN IC AND AN ANTENNA
    Publication number: 20200311508
    Abstract: Method for manufacturing an RFID tag comprising an IC and an antenna. The method comprising the steps of providing an antenna made of a soldering material, which antenna is at least partly covered with a hot melt adhesive in solid form; heating the antenna to a temperature above its melting point, wherein the heated parts of the antenna and the hot melt adhesive melt, placing an IC in a predetermined position which position is suitable for the IC to connect to the antenna; pressing the IC and antenna together, such that, an electrical connection between the IC and the antenna is established; and cooling RFID tag, such that the hot melt adhesive and the antenna solidify, wherein a soldered joint between the IC and the antenna is achieved and the hot melt adhesive surrounds the joint between the IC and the antenna.
    Type: Application
    Filed: October 31, 2018
    Publication date: October 1, 2020
    Applicant: Stora Enso OYJ
    Inventors: Lauri Huhtasalo, Eerik Halonen, Juha Ikonen