Abstract: A driving related system that may include an integrated circuit (IC) that may include IC conductors and test unit; a PCB that may include PCB conductors; intermediate conductors for coupling the IC conductors to the PCB conductors; wherein the test unit is configured to: electrically test a continuity of a first conductive path that comprises a first group of intermediate conductors, a first group of IC conductors and a first group of PCB conductors; and generate a continuity fault indication when detecting a discontinuity of the first conductive path; and wherein the driving related system is configured to perform a safety measure, in response to a generation of one or more continuity fault indications.

Abstract: A driving related system that may include an integrated circuit (IC) that may include IC conductors and test unit; a PCB that may include PCB conductors; intermediate conductors for coupling the IC conductors to the PCB conductors; wherein the test unit is configured to: electrically test a continuity of a first conducive path that comprises a first group of intermediate conductors, a first group of IC conductors and a first group of PCB conductors; and generate a continuity fault indication when detecting a discontinuity of the first conductive path; and wherein the driving related system is configured to perform a safety measure, in response to a generation of one or more continuity fault indications.

Abstract: A system on chip that comprises independent paths that applies ASIL decomposition in order to comply with an ASIL level.

Abstract: A method, system and apparatus for deriving a secondary secret from a root secret are described, the method, system and apparatus including reserving a memory buffer included in an integrated circuit, the memory buffer being large enough to contain all of the bits which will include the secondary secret, receiving a plurality of bits from a root secret, the root secret being stored in a secure memory of the integrated circuit, inputting the plurality of bits from the root secret and at least one control bit into a permutation network, and thereby producing a multiplicity of output bits, the at least one control bit including one of one bit of a value g, and one bit an output of a function which receives g as an input, receiving the multiplicity of output bits from the permutation network, inputting the multiplicity of output bits from the permutation network into a plurality of logic gates, thereby combining the multiplicity of output bits, wherein a fixed number of bits is output from the logic gates, inputt

Abstract: A method, system and apparatus for deriving a secondary secret from a root secret are described, the method, system and apparatus including reserving a memory buffer included in an integrated circuit, the memory buffer being large enough to contain all of the bits which will include the secondary secret, receiving a plurality of bits from a root secret, the root secret being stored in a secure memory of the integrated circuit, inputting the plurality of bits from the root secret and at least one control bit into a permutation network, and thereby producing a multiplicity of output bits, the at least one control bit including one of one bit of a value g, and one bit an output of a function which receives g as an input, receiving the multiplicity of output bits from the permutation network, inputting the multiplicity of output bits from the permutation network into a plurality of logic gates, thereby combining the multiplicity of output bits, wherein a fixed number of bits is output from the logic gates, inputt

Abstract: A system for personalizing one or more electrical circuits having plurality of layers with electrical characteristics. The layers being produced by an electrical characteristic determination process (ECDP). The system for personalizing includes a wafer stage for receiving a wafer in order to produce a plurality of electrical circuits. The system is configured to apply a personalization process during production of the layers. The personalization process includes using a first ECDP in the layer to product identical electrical characteristics on the wafer in each of the plurality of electrical circuits, and using a second ECDP in the layer to modify one or more electrical characteristics in selected electrical circuits so as to incorporate in the selected circuits an individualized digital number, giving rise to the desired personalizing of one or more of the specified electrical circuits. Related apparatus and methods are also provided.

Abstract: A system for personalizing one or more electrical circuits having plurality of layers with electrical characteristics. The layers being produced by an electrical characteristic determination process (ECDP). The system for personalizing includes a wafer stage for receiving a wafer in order to produce a plurality of electrical circuits. The system is configured to apply a personalization process during production of the layers. The personalization process includes using a first ECDP in the layer to produce identical electrical characteristics on the wafer in each of the plurality of electrical circuits, and using a second ECDP in the layer to modify one or more electrical characteristics in selected electrical circuits so as to incorporate in the selected circuits an individualized digital number, giving rise to the desired personalizing of one or more of the specified electrical circuits. Related apparatus and methods are also provided.

Abstract: A system for personalizing one or more electrical circuits having plurality of layers with electrical characteristics. The layers being produced by an electrical characteristic determination process (ECDP). The system for personalizing includes a wafer stage for receiving a wafer in order to produce a plurality of electrical circuits. The system is configured to apply a personalization process during production of the layers. The personalization process includes using a first ECDP in the layer to produce identical electrical characteristics on the wafer in each of the plurality of electrical circuits, and using a second ECDP in the layer to modify one or more electrical characteristics in selected electrical circuits so as to incorporate in the selected circuits an individualize digital number, giving rise to the desired personalizing of one or more of the specified electrical circuits. Related apparatus and methods are also provided.