Abstract: A semiconductor package includes a substrate including a die pad, first and second discrete transistor dies mounted on the die pad, an encapsulant body that encapsulates the first and second discrete transistor dies, and a plurality of leads that are exposed from the encapsulant body, wherein the first and second discrete transistor dies are connected in parallel with one another by electrical interconnections that electrically connect common terminals of the first and second discrete transistor dies to one of the leads, and wherein at least one of the electrical interconnections has a balanced configuration that provides substantially identical electrical impedance as between the common terminals of the first and second discrete transistor dies and the lead to which they are connected.

Abstract: A semiconductor package includes a substrate including a die pad, first and second discrete transistor dies mounted on the die pad, an encapsulant body that encapsulates the first and second discrete transistor dies, and a plurality of leads that are exposed from the encapsulant body, wherein the first and second discrete transistor dies are connected in parallel with one another by electrical interconnections that electrically connect common terminals of the first and second discrete transistor dies to one of the leads, and wherein at least one of the electrical interconnections has a balanced configuration that provides substantially identical electrical impedance as between the common terminals of the first and second discrete transistor dies and the lead to which they are connected.

Abstract: A power semiconductor device includes: at least one substrate; at least one power semiconductor die arranged over the at least one substrate; a first leadframe arranged over the at least one power semiconductor substrate and over the at least one power semiconductor die, the first leadframe being arranged at least partially in a first plane and including one or more connecting portions extending out of the first plane in a first direction; and a second leadframe at least partially arranged in a second plane above or below the first plane and including one or more attachment sites. The one or more connecting portions extend into the second plane at the one or more attachment sites. The one or more connecting portions are arranged at a non-zero distance from the second leadframe, the non-zero distance being bridged by weld seams at the one or more attachment sites.

Abstract: A semiconductor package includes a substrate including a die pad, first and second discrete transistor dies mounted on the die pad, an encapsulant body that encapsulates the first and second discrete transistor dies, and a plurality of leads that are exposed from the encapsulant body, wherein the first and second discrete transistor dies are connected in parallel with one another by electrical interconnections that electrically connect common terminals of the first and second discrete transistor dies to one of the leads, and wherein at least one of the electrical interconnections has a balanced configuration that provides substantially identical electrical impedance as between the common terminals of the first and second discrete transistor dies and the lead to which they are connected.

Abstract: A molded power semiconductor module includes: one or more power semiconductor dies; a molded body at least partially encapsulating each power semiconductor die and having opposing first and second sides, and lateral sides connecting the first and second sides; and first and second power contacts arranged laterally next to each other at a first one of the lateral sides of the molded body and electrically coupled to the power semiconductor die(s). The power contacts each have opposing first and second sides, each first side having an exposed part exposed from the molded body, each second side having a part that is arranged in a vertical direction below an outline of the respective exposed part of the first side and that is at least partially covered by a protrusion part of the molded body. The vertical direction is perpendicular to the first and second sides of the power contacts.

Abstract: The operating device (10) for a vehicle is provided with a housing (12) having a front wall (14). On the front wall (14) there is at least one operating element (18) which can be operated manually starting from an initial position for the purpose of inputting a command or activating a function. The operating element (18) has associated therewith a switch (32) having a switching member (36) upon which the operating key acts when manually operated. A supporting element (24) is also situated in the housing (12) at a distance from the operating element (18), on which supporting element (24) the switch (32) associated with the operating element (18) is situated, wherein the supporting element (24) has a flexible bar (40) having an upper surface (42) facing the operating element (18) and a lower surface (44) facing away from the upper surface (42), and the switch (32) is situated on the flexible bar.

Abstract: The operating device (10) for a vehicle is provided with a housing (12) having a front wall (14). On the front wall (14) there is at least one operating element (18) which can be operated manually starting from an initial position for the purpose of inputting a command or activating a function. The operating element (18) has associated therewith a switch (32) having a switching member (36) upon which the operating key acts when manually operated. A supporting element (24) is also situated in the housing (12) at a distance from the operating element (18), on which supporting element (24) the switch (32) associated with the operating element (18) is situated, wherein the supporting element (24) has a flexible bar (40) having an upper surface (42) facing the operating element (18) and a lower surface (44) facing away from the upper surface (42), and the switch (32) is situated on the flexible bar.

Abstract: The operating device, in particular for a vehicle component, is provided with a rotary operating element (18), which can be rotated about a rotation axis (20) and is formed as a plastic injection-molded part, which is produced in a molding die (48) having a die separation plane (46), and with a bearing unit (12), on which the rotary operating element (18) is mounted such that it can rotate about the rotation axis (20). The bearing unit (12) has a first bearing element (14), which is formed as a plastic injection-molded part, which is produced in a molding die (28) having a die separation plane (34). The first bearing element (14) has a bearing surface (26), which extends in a radial plane to the rotation axis (20) and concentrically to same, and the rotary operating element (18) has a contact surface (36), which bears against the bearing surface (26) and likewise extends in a radial plane to the rotation axis (20) and concentrically to same.

Abstract: The latching device for a rotationally or translationally movable operating element is provided with a resiliently mounted latching projection and with a latching guideway which is in sliding contact with the latching projection and which has a plurality of latching depressions with latching elevations arranged between them. The latching depressions and the latching elevations form a substantially corrugated latching path along which the latching projection slides during a relative movement between latching guideway and latching projection. The latching projection has a surface which contacts the latching path along at least one contact line running substantially transversely to the longitudinal extent of the latching path. When sliding along the latching path, the latching projection experiences an upward and downward movement with periodic change of the orientation of its contact line with respect to the latching guideway.

Abstract: The operating device, in particular for a vehicle component, is provided with a rotary operating element (18), which can be rotated about a rotation axis (20) and is formed as a plastic injection-molded part, which is produced in a molding die (48) having a die separation plane (46), and with a bearing unit (12), on which the rotary operating element (18) is mounted such that it can rotate about the rotation axis (20). The bearing unit (12) has a first bearing element (14), which is formed as a plastic injection-molded part, which is produced in a molding die (28) having a die separation plane (34). The first bearing element (14) has a bearing surface (26), which extends in a radial plane to the rotation axis (20) and concentrically to same, and the rotary operating element (18) has a contact surface (36), which bears against the bearing surface (26) and likewise extends in a radial plane to the rotation axis (20) and concentrically to same.

Abstract: The latching device for a rotationally or translationally movable operating element is provided with a resiliently mounted latching projection and with a latching guideway which is in sliding contact with the latching projection and which has a plurality of latching depressions with latching elevations arranged between them. The latching depressions and the latching elevations form a substantially corrugated latching path along which the latching projection slides during a relative movement between latching guideway and latching projection. The latching projection has a surface which contacts the latching path along at least one contact line running substantially transversely to the longitudinal extent of the latching path. When sliding along the latching path. the latching projection experiences an upward and downward movement with periodic change of the orientation of its contact line with respect to the latching guideway.