Abstract: A circuit board includes a ground layer, a core layer positioned on the ground layer, an insulating layer positioned on the core layer, and a trace positioned between the core layer and the insulating layer. The circuit board also includes another ground layer positioned on the insulating layer, and an electromagnetic shield (EMS) extending between and electrically connected to the ground layers alongside the trace to shield the trace from electromagnetic radiation. The EMS extends along at least 90% of a length of the trace.

Abstract: An optical assembly is provided and includes a first component configured to output light, a second component and an adhesive bonding agent to which a photochromic reactive agent is added and by which the first and second components are attached such that the first component is disposed to output the light toward the second component and such that the photochromic reactive agent is exposed to the light in an event of the first and second components being attached in a misaligned condition whereupon a color change of the photochromic reactive agent resulting from exposure of the photochromic reactive agent to the light is indicative of the misaligned condition.

Abstract: A circuit board includes a ground layer, a core layer positioned on the ground layer, an insulating layer positioned on the core layer, and a trace positioned between the core layer and the insulating layer. The circuit board also includes another ground layer positioned on the insulating layer, and an electromagnetic shield (EMS) extending between and electrically connected to the ground layers alongside the trace to shield the trace from electromagnetic radiation. The EMS extends along at least 90% of a length of the trace.

Abstract: A method of making a printed circuit board is disclosed. The method includes forming a plurality of layers. The method further includes forming a stack including the plurality of layers such that topmost and bottommost layers of the stack are copper layers and such that inner layers of the stack include resin layers and further copper layers. The method further includes thermocompressing the stack to form a panel such that the resin layers conform to the further copper layers and such that the copper layers bend around a perimeter of the inner layers. The method further includes separating a printed circuit board from the panel such that the printed circuit board's widest extent defines its final width.