Patents by Inventor Egon Herr

Egon Herr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure contract spring for contact arrangement in power semiconductor module
    Patent number: 7264481
    Abstract: The pressure contact spring (3) according to the invention comprises two contacting regions (31, 32) for contacting metallized contact pads (1, 2), one contacting region comprising a contact tip (31). Arranged between the contacting regions is a compressing region (33). The contact tip is rounded with an outer radius. The rounded contact tip penetrates only little into the metallization of the contact pad even under high spring force.
    Type: Grant
    Filed: August 22, 2003
    Date of Patent: September 4, 2007
    Assignee: ABB Schweiz AG
    Inventors: Egon Herr, Jerôme Assal
  • Pressure contact spring for contact arrangement in a power semiconductor module
    Publication number: 20060240685
    Abstract: The pressure contact spring (3) according to the invention comprises two contacting regions (31, 32) for contacting metallized contact pads (1, 2), one contacting region comprising a contact tip (31). Arranged between the contacting regions is a compressing region (33). The contact tip is rounded with an outer radius. The rounded contact tip penetrates only little into the metallization of the contact pad even under high spring force.
    Type: Application
    Filed: August 22, 2003
    Publication date: October 26, 2006
    Applicant: ABB Schweiz AG
    Inventors: Egon Herr, Jerome Assal
  • High power semiconductor module
    Patent number: 7005739
    Abstract: The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.
    Type: Grant
    Filed: May 30, 2002
    Date of Patent: February 28, 2006
    Assignee: ABB Schweiz AG
    Inventors: Stefan Kaufmann, Thomas Lang, Egon Herr, Mauro Nicola, Soto Gekenidis
  • High power semiconductor module
    Publication number: 20040207070
    Abstract: The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.
    Type: Application
    Filed: June 10, 2004
    Publication date: October 21, 2004
    Inventors: Stefan Kaufmann, Thomas Lang, Egon Herr, Mauro Nicola, Soto Gekenidis