Abstract: In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3.x in a conveyorized system, the electric currents originating from various counter electrodes 5.x in the plant are set to values in function of the electrolytically to be processed surface areas of the work pieces 3.x as far as they are located directly opposite the respective ones of the various counter electrodes 5.x. Moreover, the distance between the work pieces 3.x and the counter electrodes 5.x is chosen to be 50 mm maximum. Means 19 for individually controlling and adjusting every single current supply unit 15.x of the counter electrodes 5.x are provided for this purpose. Said means 19 are configured in such a manner that the respective electric currents originating from the various counter electrodes 5.x are settable to values in function of the electrolytically to be processed surface areas of the work pieces 3.

Abstract: In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for bringing treatment liquid into contact with the workpieces 9, means 10 for electrical contracting of the workpieces 9 at contacting sites and counterelectrodes 5.x which are so arranged that the workpieces 9 may be arranged opposing them, whereby the counterelectrodes 5.x are each subdivided into at least two electrode segments 13.x such that at least one contact-near electrode segment 13.1 and at least one contact-remote electrode segment 13.4 and possibly further electrode segments 13.2, 13.3 arranged between them are provided and each electrode segment 13.x is fed by a separate current source 15.x.

Abstract: To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.

Abstract: A surface treatment of electrical contact pieces in electrolytic plants, in particular of machines for the treatment of circuit boards and conductor sheets is discloses, wherein the contact pieces are made of titanium or some other oxidizing and therefore chemically and electrochemically resistant material. To eliminate unwanted metallization of the contact pieces as a result of an inadequate demetallization on account of the insulating oxide layer and in order to enhance protection against wear, an electrically conductive diamond coating is applied at least on the contact-making areas of the contact pieces.

Abstract: For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory element 9, 10, more specifically a contact roll, is used for placing the printed circuit boards and films in electric contact, an elastic, electrically conductive material 2, 5, 6 being at least partially applied on the running tread unreeling on the printed circuit boards and films.

Abstract: For electrolytic treatment of electrically mutually insulated, electrically conductive structures 4 on surfaces of electrically insulating foil material (Fo), is unloaded from a store 15?, 15?, transported on a conveying line through a treatment unit 1 and brought in contact with treatment fluid F1. During transportation, the material Fo is guided past at least one electrode arrangement, having at least one cathodically polarised electrode 6 and at least one anodically polarised electrode 7, both being brought in contact with the treatment fluid F1 and being connected to a current/voltage source 8. Current flows through the electrodes 6, 7 and the electrically conductive structures 4. The electrodes 6, 7 are screened from each other so that substantially no electric current is able to flow directly between oppositely polarised electrodes 6, 7. The material Fo is finally loaded back onto a store 15?, 15?.

Abstract: For electrolytic treatment of circuit boards and foils LP, a method and a device are used in which the sheets and foils are transported through a treatment unit and brought thereby in contact with treatment fluid 3. The sheets and foils are guided during transportation past at least one electrode arrangement, which comprises respectively cathodically polarized electrodes 6 and anodically polarized electrodes 7, the cathodically and anodically polarized electrodes also being brought in contact with the treatment fluid. The cathodically polarized electrodes and the anodically polarized electrodes are connected to a current/voltage source 8, so that a current flows through the electrodes 6, 7 and the electrically conductive surfaces 4.

Abstract: To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising contact carriers, more specifically clamps, clips and like, with contact elements for supplying the current to the work is utilized, and at least the contact areas of the contact elements that may be brought to contact the work are made from an elastic, electrically conductive material.

Abstract: The invention relates to a device and a to method of transporting flat workpieces in wet-chemical conveyorized processing lines. It is preferably used to process printed circuit boards and printed circuit foils. A device is proposed in which the upper rollers (1) and the lower rollers (2) are alternately provided with such different diameters that the force the upper roller (1) exerts upon the printed circuit boards and printed circuit foils (4) is limited.

Abstract: To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.

Abstract: In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3.x in a conveyorized system, the electric currents originating from various counter electrodes 5.x in the plant are set to values in function of the electrolytically to be processed surface areas of the work pieces 3.x as far as they are located directly opposite the respective ones of the various counter electrodes 5.x. Moreover, the distance between the work pieces 3.x and the counter electrodes 5.x is chosen to be 50 mm maximum. Means 19 for individually controlling and adjusting every single current supply unit 15.x of the counter electrodes 5.x are provided for this purpose. Said means 19 are configured in such a manner that the respective electric currents originating from the various counter electrodes 5.x are settable to values in function of the electrolytically to be processed surface areas of the work pieces 3.

Abstract: In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for bringing treatment liquid into contact with the workpieces 9, means 10 for electrical contracting of the workpieces 9 at contacting sites and counterelectrodes 5.x which are so arranged that the workpieces 9 may be arranged opposing them, whereby the counterelectrodes 5.x are each subdivided into at least two electrode segments 13.x such that at least one contact-near electrode segment 13.1 and at least one contact-remote electrode segment 13.4 and possibly further electrode segments 13.2, 13.3 arranged between them are provided and each electrode segment 13.x is fed by a separate current source 15.x.

Abstract: The invention relates to carriers serving to supply current to workpieces to be treated electrolytically or counter-electrodes and a method for the electrolytic treatment of workpieces. The carriers according to the invention comprise at least three elongate electric current conductors, disposed parallel to one another, a first current conductor being configured in such a way that the workpieces or counter-electrodes can, for supplying electric current or for mechanical attachment, be attached to the conductor directly or via holding devices, respectively a second to nth current conductor is provided, the second current conductor being connected to the first current conductor, the third current conductor to the second current conductor etc.

Abstract: To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising contact carriers 4, 5, 10, 11, more specifically clamps, clips and the like, with contact elements 8 for supplying the current to the work 6 is utilized, at least the contact areas of the contact elements 8 that may be brought to contact the work 6 are made from an elastic, electrically conductive material.

Abstract: For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory element 9, 10, more specifically a contact roll, is used for placing the printed circuit boards and films in electric contact, an elastic, electrically conductive material 2, 5, 6 being at least partially applied on the running tread unreeling on the printed circuit boards and films.

Abstract: The invention relates to a method of generating short, cyclically repeating, unipolar or bipolar pulse currents I.sub.G, I.sub.E for electroplating, and to a circuit arrangement for electroplating with which pulse currents I.sub.G, I.sub.E can be generated. Electroplating methods of this type are referred to as pulse-plating methods. According to the invention, the secondary winding 6 of a current transformer 1 is connected in series into the electroplating direct current circuit 5, consisting of a bath direct current source 2 and a bath which is contained in an electroplating cell and which is represented by resistor R.sub.B. The primary winding 7 of the transformer has a larger number of turns than the secondary winding. The primary winding is controlled with pulses of high voltage and with relatively low current. The high pulse current on the secondary side temporarily compensates in pulses the electroplating direct current.

Abstract: A method for compensating variations of branch currents in an electrolytic bath and hence for improving the uniformity of metal layers deposited on articles, provides a compensating passive resistor having a resistance value exceeding the resistance of respective electroplating branch circuits, in series with each branch circuit. The total electroplating current is adjusted to the nominal branch currents whereby the magnitudes of the latter is determined predominantly by the compensating passive resistors.

Abstract: A method of feeding information into data processing means of an automatic galvanizing installation about articles to be treated, includes the fixing of the information onto each article before the article is supplied to the installation. In the charging station of the installation, the applied information is read by a hand-operated, commercially available data reader.

Abstract: A multi-phase regulating transformer is disclosed having a plurality of windings cooperating with stepping trolleys which are driven by a common driving member. To obtain fine adjustment of the output voltage, the trolleys are coupled to the driving member with different plays to introduce a dead travel of the driving member relative to at least one trolley, which exceeds the spacing between two adjoining individual windings of the transformer.

Abstract: An arrangement for processing information pertaining to articles to be treated in automatic electroplating plants with work stations, article transport means, and article storage or holding locations. To each transport device and each location in the electroplating plant, there is assigned at least one storage unit which is logically connected with the central control unit and with the transport device circuit elements triggering the transport operation. It is also connected with the article storage or holding locations. The prevailing information pertaining to the articles treated is always inserted in that storage which is assigned to the transport device or to the location where the article is positioned at that time.