Abstract: The present invention relates to an antenna module (45) for producing a transponder, wherein the antenna module comprises an antenna conductor arrangement disposed on a substrate surface (46) of a substrate (47) and having an antenna conductor (50) for contacting with a chip (40), wherein the antenna conductor (50) forms a first antenna part (51) having a first terminal end on a first partial area (48) of the substrate surface, and with a second terminal end extends to a second partial area (49) of the substrate surface to form a second antenna part (52), wherein antenna connection contacts (57, 61) are disposed on the respective partial areas, such that the antenna connection contacts can be brought into an overlapping position for producing an electrically conductive connection by swiveling the partial areas with respect to each other.

Abstract: The invention relates to a laminate structure (30) for a chip card (31), comprising a base layer (35), a chip module (32) accommodated at least partially in the base layer, and at least one cover layer (39) that covers the base layer, wherein an intermediate space (61) formed between the chip module and the cover layer as well as between the chip module and the base layer is filled with an adhesive material, wherein the adhesive material generates adhesive forces with respect to the wetted surfaces of the base layer and of the cover layer and generates adhesive forces with respect to the wetted surfaces of the chip module as well.

Abstract: The present invention relates to an antenna module (45) for producing a transponder, wherein the antenna module comprises an antenna conductor arrangement disposed on a substrate surface (46) of a substrate (47) and having an antenna conductor (50) for contacting with a chip (40), wherein the antenna conductor (50) forms a first antenna part (51) having a first terminal end on a first partial area (48) of the substrate surface, and with a second terminal end extends to a second partial area (49) of the substrate surface to form a second antenna part (52), wherein antenna connection contacts (57, 61) are disposed on the respective partial areas, such that the antenna connection contacts can be brought into an overlapping position for producing an electrically conductive connection by swiveling the partial areas with respect to each other.

Abstract: A transponder unit which can be integrated in a transport unit or a card or the like. The transponder unit includes, in addition to an encapsulated transponder of an integrated circuit, an aerial winding having a resistance RA and a capacitor parallel thereto and having a capacitance CA. A closed coupling circuit of secondary winding is coupled with the aerial winding by a mutual inductance MSA and a substantially larger primary winding in series with the secondary winding and having fewer turns, for example only one turn. To achieve almost optimum energy transfer between a reading device and the transponder and to increase the permissible reading distance, the mutual inductance MSA is adjusted to comply with the relationship MSA=?{square root over ( )}[RA/?) (LP+LS+2MPS)], where ?2=1/(LACA) is true for the receiving frequency ? of the transponder and Lp and LS are the inductances of the primary winding and of the secondary winding and MPS is their mutual inductance.