Patents by Inventor Ehab Nasir

Ehab Nasir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7432202
    Abstract: A method includes forming a coating on a land contact of a package substrate, the coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold. An apparatus includes a package substrate including a plurality of land contacts wherein each of the plurality of land contacts includes a coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: October 7, 2008
    Assignee: Intel Corporation
    Inventors: Bijay S. Saha, Munehiro Toyama, Ehab A. Nasir, Omar J. Bchir, Charavana K. Gurumurthy
  • Publication number: 20070148971
    Abstract: A method includes forming a coating on a land contact of a package substrate, the coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold. An apparatus includes a package substrate including a plurality of land contacts wherein each of the plurality of land contacts includes a coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold.
    Type: Application
    Filed: December 28, 2005
    Publication date: June 28, 2007
    Inventors: Bijay Saha, Munehiro Toyama, Ehab Nasir, Omar Bchir, Charavana Gurumurthy